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The DF200R12KE3HOSA1 is a dual IGBT module from Infineon Technologies, utilizing Trenchstop technology. It features a maximum collector-emitter voltage of 1200 V and a continuous collector current of 200 A at 25°C, with a repetitive peak current capability of 400 A. The device has a typical saturation voltage of 1.7 V at 200 A and 25°C. Total power dissipation reaches 1040 W. Thermal resistance from junction to case is 0.12 K/W for the transistor and 0.15 K/W for the diode. The module operates within a temperature range of -40°C to +125°C.
Verify the specific ordering suffix against official documentation to ensure correct packaging and terminal configuration. Confirm that the component meets RoHS compliance requirements for your region. Cross-reference the datasheet revision number to validate electrical parameters before integration into production designs.
Select this module based on its 1200V rating and 200A continuous current capacity. Evaluate thermal management needs using the specified junction-to-case thermal resistance values. Ensure gate drive circuits can handle the required ±15V swing and manage the total gate charge effectively during switching transitions.
This component belongs to the EconoPACK family of modules designed for compact power electronics. It utilizes silicon-based IGBT technology combined with fast recovery diodes. The design targets high reliability and ease of mounting in standard industrial power conversion architectures.
Direct substitutes include the FF200R12KE3 and DF200R12KE3 variants. Verify pinout compatibility and thermal interface dimensions when considering these alternatives for existing board layouts.
The module supports a short-circuit current of 800 A for pulse durations up to 10 µs.
Typical switching loss data is provided for a gate resistor (RG) of 3.6 Ω.
No, the DF200R12KE3HOSA1 does not feature an integrated NTC thermistor; external thermal monitoring is required.