DMP3007SFG-7

$1.10

Description：MOSFET P-CH 30V 70A POWERDI3333
Series：-
Mfr：Diodes Incorporated
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:8f768d693923 Category: Single FETs, MOSFETs Brand: Diodes Incorporated

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Product introduction

Product Detailed Parameters

Description：MOSFET P-CH 30V 70A POWERDI3333
Series：-
Mfr：Diodes Incorporated
Package：Tape & Reel (TR),Cut Tape (CT)
FET Type：P-Channel
Technology：MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)：30 V
Current - Continuous Drain (Id) @ 25°C：70A (Tc)
Drive Voltage (Max Rds On, Min Rds On)：4.5V, 10V
Rds On (Max) @ Id, Vgs：6mOhm @ 11.5A, 10V
Vgs(th) (Max) @ Id：3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs：64.2 nC @ 10 V
Vgs (Max)：±25V
Input Capacitance (Ciss) (Max) @ Vds：2826 pF @ 15 V
FET Feature：-
Power Dissipation (Max)：2.8W (Ta)
Operating Temperature：-55°C ~ 150°C (TJ)
Grade：-
Qualification：-
Mounting Type：Surface Mount
Supplier Device Package：POWERDI3333-8
Package / Case：8-PowerVDFN

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DMP3007SFG-7

Overview

The DMP3007SFG-7 is a P-channel enhancement mode MOSFET manufactured by Diodes Incorporated. It features a -30V drain-source voltage rating and an on-resistance of 6mΩ at VGS=-10V, supporting up to -70A continuous drain current. The device utilizes a PowerDI3333-8 surface-mount package with dimensions of approximately 3.3mm x 3.3mm. Operating temperatures range from -55°C to +150°C junction temperature.

Feature Summary

Minimizes on-state resistance while maintaining superior switching performance for high efficiency power management applications.
Small form factor thermally efficient package enables higher density end products and occupies just 33% of the board area occupied by SO-8 packages.
Features ESD protected gate and lead-free finish compliant with RoHS directives.

Applications

Backlighting
Power Management Functions
DC-DC Converters

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm packaging quantity and reel specifications. Confirm that the component meets required environmental standards such as RoHS compliance and halogen-free status before finalizing procurement decisions.

Selection Notes

Select this component when low on-state resistance and compact footprint are critical requirements. Evaluate thermal resistance characteristics relative to the intended PCB copper layout to ensure adequate heat dissipation within the specified operating temperature range.

Part Context

This part belongs to the DMP series of P-channel MOSFETs designed for general-purpose power switching. It is housed in the PowerDI3333-8 package, which provides a balance between electrical performance and physical size constraints typical in modern electronic designs.