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The DN2450N8-G is an N-Channel, Depletion-Mode Vertical DMOS FET manufactured by Microchip Technology. It features a TO-243AA (SOT-89) surface-mount package and utilizes a silicon-gate manufacturing process. The device provides high-input impedance, low input capacitance, and fast switching speeds. Key electrical specifications include a drain-to-source breakdown voltage of 500 V, a maximum static on-resistance of 10 Ω at zero gate bias, and a saturated drain current of 700 mA. It operates within a temperature range of -55°C to +150°C.
Verify the specific suffix 'N8' corresponds to the TO-243AA (SOT-89) package configuration required for your design. Confirm that the depletion-mode characteristic aligns with your circuit's logic requirements, as this device conducts when the gate-source voltage is zero. Ensure environmental compliance matches project standards, noting the 'G' designation indicates lead-free and RoHS-compliant packaging.
Select the DN2450N8-G for applications requiring a normally-on switch or constant current source where high input impedance is critical. Consider the TO-243AA package thermal resistance of 133°C/W for heat dissipation calculations. Evaluate the 500 V breakdown voltage against peak transient voltages in the system. Verify that the 10 Ω on-resistance meets the conduction loss requirements at the intended operating current levels.
This component belongs to the DN2450 family of vertical DMOS field-effect transistors produced by Microchip Technology. The family includes variants such as the DN2450K4-G, which shares similar electrical characteristics but utilizes a TO-252 (D-Pak) package. These devices are designed for switching and amplifying applications demanding high breakdown voltage and fast switching speeds.
DN2450K4-G: Alternative package variant using TO-252 (D-Pak).
The DN2450N8-G is a depletion-mode device, meaning it is a normally-on transistor that conducts current between the drain and source when the gate-to-source voltage is zero.
The device is free from thermal runaway and thermally-induced secondary breakdown due to the positive-temperature coefficient inherent in its Metal-Oxide Semiconductor structure.