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The DP8409AD is a memory controller integrated circuit manufactured by National Semiconductor, now part of Texas Instruments. It utilizes MOS technology and is housed in a 48-pin ceramic Dual In-Line Package (DIP). The device operates within a commercial temperature range with a maximum operating temperature of 70 °C. Key electrical specifications include a maximum slew rate of 325 mA. The component is identified by the JESD-30 code R-XDIP-T48 and is not RoHS compliant.
Verify compliance status carefully as the component is explicitly listed as non-RoHS compliant. Confirm the manufacturer origin, noting that National Semiconductor assets are managed by Texas Instruments. Ensure the specific DIP-48 ceramic package matches the design requirements, as surface mount alternatives may exist within the broader family but differ physically from this through-hole variant.
Select this component when a legacy 48-pin DIP memory controller is required for commercial applications. The choice is driven by the need for MOS technology compatibility and specific form factor constraints. Verify that the 70 °C maximum operating temperature aligns with the environmental conditions of the target system.
This part belongs to the National Semiconductor memory controller portfolio, which has been integrated into Texas Instruments' product lines following corporate acquisition. It falls under the category of embedded processors and controllers, specifically serving microcontroller and processor support roles in older or specialized industrial designs requiring robust DIP packaging.