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The DRDPB16W-7 is a single pre-biased NPN bipolar junction transistor (BJT) manufactured by Diodes Incorporated. It integrates internal base resistor R1 and emitter resistor R2 within a compact SOT-363 surface-mount package. Key electrical specifications include a maximum collector-emitter voltage (VCEO) of 50 V, a continuous collector current (Ic) of 600 mA, and a transition frequency (fT) of 200 MHz. The device features a typical DC current gain (hFE) of 100 at 50 mA and 5 V, with a maximum collector cutoff current of 500 nA. Power dissipation is rated at 200 mW, and it operates within a temperature range of -55°C to +150°C.
Verify the specific suffix 'W-7' against the manufacturer's latest datasheet to confirm packaging configuration and tape-and-reel specifications. Ensure RoHS compliance status matches project requirements by checking the official environmental declaration. Confirm availability through authorized distributors as lead times may vary based on production cycles.
Select this component when a single NPN transistor with integrated biasing resistors is required for space-constrained designs. Compare the 50 V VCEO and 600 mA Ic ratings against circuit load requirements. Consider the SOT-363 footprint compatibility during PCB layout phase. Evaluate thermal management needs given the 200 mW power dissipation limit in enclosed environments.
This part belongs to the DRD series of pre-biased transistors from Diodes Incorporated. It shares the SOT-363 package form factor with other variants in the family but differs in internal resistance values and polarity. The 'N' designation indicates NPN configuration, distinguishing it from PNP counterparts like the DRDP series.
The datasheet specifies integrated base (R1) and emitter (R2) resistors, though exact nominal values should be confirmed in the official electrical characteristics table.
Yes, the device is rated for operation up to +150°C junction temperature, making it suitable for demanding thermal conditions.
The small outline package limits heat dissipation capacity; designers must ensure adequate PCB copper area for thermal management under full load.