DS92LV3241TVSX/NOPB

Overview

The DS92LV3241TVSX/NOPB is a serializer from Texas Instruments belonging to the Channel Link II family. It converts parallel LVCMOS or LVTTL data into a high-speed serial LVDS output stream. The device supports data rates up to 50 MHz per channel and includes an integrated clock driver for source-synchronous transmission. It operates on a single 3.3 V power supply with a maximum operating temperature of 85°C and is housed in a TVSOP-28 package.

Feature Summary

• Performs parallel-to-serial conversion using LVDS technology
• Supports source-synchronous clocking architecture
• Integrates a dedicated clock driver for signal integrity

Applications

• High-resolution video display interfaces
• Industrial control system data links
• Medical imaging equipment signal transmission

Procurement Notes

Verify the specific suffix against official manufacturer documentation to confirm pinout compatibility and electrical characteristics. Ensure the component matches the required RoHS compliance standards for your assembly process. Cross-reference the datasheet revision history to validate any recent design changes or updates before finalizing procurement specifications.

Selection Notes

Select this component when a single-channel serialization solution is required for LVCMOS or LVTTL inputs. It is suitable for applications needing a compact form factor with integrated clock driving capabilities. Evaluate the 50 MHz bandwidth requirement against the system's data throughput needs to ensure adequate performance margins.

Part Context

This part belongs to the Channel Link II series, designed for reliable point-to-point communication. It complements deserializers like the DS92LV3242 to form complete interface bridges. The series focuses on reducing trace count and electromagnetic interference in dense electronic layouts.

Replacement Considerations

Direct substitutes include the DS92LV3241TMX/NOPB which shares identical functionality but utilizes a TSSOP-28 package instead of TVSOP-28. Verify mechanical footprint differences during PCB layout adaptation.