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The onsemi DTA114YET1 is a PNP Bias Resistor Transistor (BRT) housed in the SC-75/SOT-416 package. It integrates a single transistor with a monolithic bias network consisting of a series base resistor (R1 = 10 kΩ) and a base-emitter resistor (R2 = 47 kΩ). The device supports a maximum collector current of 100 mA and withstands collector-emitter voltages up to 50 Vdc. Key electrical characteristics include a minimum DC current gain (hFE) of 80 at 5 mA and 10 V, a maximum collector-emitter saturation voltage of 250 mV at 10 mA, and a total power dissipation of 200 mW.
Verify that the specific part number matches the required resistor values (R1=10k, R2=47k) and polarity (PNP). Confirm compliance with automotive qualification standards if the application requires AEC-Q101 certification. Ensure the ordering suffix aligns with the desired packaging format, such as tape and reel quantities specified in the manufacturer's documentation.
Select this component when a compact solution is needed to simplify circuit design by reducing the bill of materials. The integrated bias network allows for straightforward on/off control without external resistors. Verify that the 100 mA collector current and 50 V breakdown voltage meet the system requirements before implementation.
This device belongs to the DTA114EET1 Series, which includes various PNP BRT configurations with different internal resistor ratios. The DTA114YET1 specifically utilizes a 10 kΩ base resistor and a 47 kΩ emitter-base resistor. Complementary NPN types are available within the same series for differential signaling or push-pull applications.
SDTA114YET1G
The device contains a monolithic bias network with a 10 kΩ series base resistor (R1) and a 47 kΩ base-emitter resistor (R2), which eliminates the need for external resistors in inverter circuits.
Yes, the datasheet indicates that the device is AEC-Q101 qualified and PPAP capable, making it suitable for automotive and other demanding applications.
The SC-75/SOT-416 package features modified gull-winged leads designed to absorb thermal stress during wave or reflow soldering processes, thereby protecting the die from damage.