EFM-03

Overview

The CESYS EFM-03 is a hardware reference module featuring a Xilinx Artix-7 XC7A200T-2FBG676I FPGA and a Cypress EZ-USB FX3 controller. It provides up to 320 MByte/s sustained data transfer via USB 3.0 SuperSpeed. The board includes 2 GByte DDR3L memory with 3.2 GB/s bandwidth, 32 MByte Quad-SPI flash, and a 1 Mbit I²C EEPROM. Operating from a single 5 V supply, it supports bus-powered or self-powered modes. Dimensions are 52.6 mm x 82.6 mm, with an operating temperature range of 0°C to 45°C under natural convection.

Feature Summary

• Xilinx Artix-7 XC7A200T-2FBG676I FPGA with 215,360 logic cells
• Cypress EZ-USB FX3 controller for USB 3.0 SuperSpeed interface
• 2 GByte DDR3L SDRAM (3.2 GB/s bandwidth) and 32 MByte Quad-SPI flash
• Expansion connectors providing 191 single-ended/differential IOs and GTP quad columns

Applications

• Image processing systems
• Video capture devices
• Smart camera implementations
• High-speed FPGA co-processor modules
• Custom test equipment

Procurement Notes

Verify the specific hardware revision, as the documentation covers Rev. A. Confirm power supply requirements; while bus-powered operation is supported, high-performance configurations may require external 5V power due to current demands exceeding standard USB limits. Ensure mating connectors match the specified Samtec QSE series for proper mechanical integration.

Selection Notes

Select this module when a compact form factor is required alongside high-bandwidth USB 3.0 data transfer. The Artix-7 FPGA density suits moderate complexity logic designs. Consider thermal management, as the specified operating temperature limit of 45°C assumes natural convection; active cooling may be necessary for sustained maximum throughput loads.

Part Context

The EFM-03 serves as a development platform leveraging the Xilinx 7 Series architecture and Cypress FX3 USB controller. It is designed to accelerate prototyping for applications requiring high-speed data acquisition and processing. The module maintains pinout compatibility with the preceding EFM-02/B model, facilitating migration for existing designs.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should evaluate other CESYS EFM series modules or generic FPGA+FX3 carrier boards if direct replacement is required.