EMZ8T2R

Overview

The EMZ8T2R is a Zener diode manufactured by Rohm Semiconductor, designed for surface mount applications. It features an EMD5 package code and SOT-553 (JEITA SC-107BB) form factor with five terminals. The device provides a typical Zener voltage of 8V, with a minimum of 7.6V and a maximum of 8.4V at a test current of 5mA. Power dissipation is rated at 150mW, with a maximum junction temperature of 150°C. Operating temperatures range from -55°C to 150°C.

Feature Summary

• Compact plastic package design suitable for space-constrained layouts
• High reliability construction for stable voltage regulation
• Surface mount configuration for automated assembly

Applications

• Voltage reference circuits
• Transient voltage suppression
• Clamping applications in consumer electronics

Procurement Notes

Verify the specific ordering suffix and RoHS compliance status directly against the manufacturer's latest documentation before procurement. Confirm that the component meets all required environmental specifications for the intended operating conditions. Ensure compatibility with existing supply chain requirements and quality standards.

Selection Notes

Select this component based on the required Zener voltage tolerance and power dissipation capabilities. Verify that the SOT-553 package dimensions fit the PCB layout constraints. Consider the thermal management requirements given the 150mW power rating and the maximum junction temperature limit of 150°C.

Part Context

This part belongs to Rohm's series of Zener diodes, which are commonly used for voltage regulation and protection. The EMZ8T2R specifically offers an 8V breakdown voltage in a compact surface mount package, making it suitable for various electronic devices requiring precise voltage references or transient protection.

Replacement Considerations

Check for direct pin-compatible substitutes with identical electrical characteristics if this part is discontinued. Verify that any replacement maintains the same Zener voltage tolerance, power rating, and package dimensions to ensure seamless integration without redesigning the circuit board.