EP1SGX25CF672C6

Overview

The EP1SGX25CF672C6 is a Stratix GX Field Programmable Gate Array (FPGA) manufactured by Altera. It features 25,660 logic elements and 1,944,576 total RAM bits. The device includes eight high-speed serial transceiver channels capable of full-duplex operation from 500 Mbps to 3.1875 Gbps. It operates with a 1.5-V logic array and supports various I/O standards including LVDS and PCML. The component is housed in a 672-pin FineLine BGA package measuring 27x27 mm and functions within a temperature range of 0°C to 85°C.

Feature Summary

• Contains 25,660 logic elements and 1,944,576 total RAM bits across M512, M4K, and M-RAM blocks.
• Integrates eight high-speed serial transceiver channels supporting data rates up to 3.1875 Gbps.
• Includes programmable pre-emphasis, equalization, and output voltage settings for signal integrity.
• Supports protocols such as Gigabit Ethernet, XAUI, SONET/SDH, PCI Express, and Fibre Channel.

Applications

• High-speed backplane interface systems
• Chip-to-chip communication links
• Communications protocol bridging
• Digital video transmission implementations

Procurement Notes

Verify the specific speed grade suffix 'C6' against the manufacturer's official datasheet tables to confirm timing characteristics. Ensure the 672-pin FineLine BGA package dimensions match the design footprint requirements. Confirm that the operating temperature range aligns with the system environment specifications.

Selection Notes

Select this model when requiring vertical migration capabilities within the 672-pin package alongside EP1SGX10 or EP1SGX40 devices. Consider the eight available transceiver channels for bandwidth needs. Evaluate the 1.5-V power supply requirements and the availability of PLL resources for clock generation tasks.

Part Context

This component belongs to the Stratix GX family, which combines high-performance logic arrays with embedded high-speed serial transceivers. The architecture utilizes TriMatrix memory technology and dedicated DSP blocks. It is designed for applications demanding low power consumption and small die size while maintaining high data throughput capabilities.

Replacement Considerations

Vertical migration is supported within the same 672-pin package to EP1SGX10C or EP1SGX25C variants. Designers must verify that dedicated pins, configuration pins, and power pins remain identical across densities. Cross-reference I/O pin availability using device pin-outs for planned densities.