EP1SGX25DF672I6

Overview

The EP1SGX25DF672I6 is a Stratix GX Field Programmable Gate Array (FPGA) featuring 25,660 logic elements and 455 I/Os. It operates within a -40°C to +100°C temperature range and utilizes a 672-pin FineLine BGA package measuring 27x27 mm. The device supports high-speed serial transceivers with data rates up to 3.1875 Gbps and includes TriMatrix memory resources totaling 1,944,576 bits.

Feature Summary

• Stratix GX architecture with 25,660 logic elements and 22 source-synchronous channels
• High-speed serial transceivers supporting 500 Mbps to 3.1875 Gbps full-duplex operation
• TriMatrix memory comprising M512, M4K, and M-RAM blocks for flexible storage implementation
• Integrated DSP blocks with dedicated multipliers for FIR filter and multiply-accumulate functions

Applications

• High-speed backplane interface systems
• Chip-to-chip communication links
• Communications protocol bridging
• Support for XAUI, Gigabit Ethernet, SONET/SDH, and Fibre Channel standards

Procurement Notes

Verify the specific speed grade suffix against the datasheet Table 4 to ensure timing compatibility. Confirm that the 672-pin FBGA footprint matches the target PCB design constraints. Check for vertical migration options within the same package if future density upgrades are required.

Selection Notes

Select this model for designs requiring up to 25,660 LEs and 455 I/Os in a compact 672-pin package. Ensure the application utilizes the 1.5-V logic array voltage. Verify that the required transceiver count does not exceed the eight channels available in the EP1SGX25D variant.

Part Context

This component belongs to the Altera Stratix GX family, which combines high-performance logic arrays with embedded high-speed serial transceivers. The EP1SGX25DF672I6 represents a mid-range density option within the series, offering vertical migration capabilities to other devices like the EP1SGX10C or EP1SGX40G in the same package.

Replacement Considerations

Vertical migration is supported within the 672-pin FineLine BGA package. Designers can migrate between EP1SGX10C, EP1SGX25C, and EP1SGX40G devices provided dedicated pins, configuration pins, and power pins remain compatible across densities.