EPC2204

EPC2204

$2.75
  • Description:TRANS GAN 100V DIE 5.6MOHM
  • Series:eGaN®
  • Mfr:EPC
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:6ffdc715250b Category: Brand:

  
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Product Detailed Parameters

  • Description:TRANS GAN 100V DIE 5.6MOHM
  • Series:eGaN®
  • Mfr:EPC
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • FET Type:N-Channel
  • Technology:GaNFET (Gallium Nitride)
  • Drain to Source Voltage (Vdss):100 V
  • Current - Continuous Drain (Id) @ 25°C:29A (Ta)
  • Drive Voltage (Max Rds On, Min Rds On):5V
  • Rds On (Max) @ Id, Vgs:6mOhm @ 16A, 5V
  • Vgs(th) (Max) @ Id:2.5V @ 4mA
  • Gate Charge (Qg) (Max) @ Vgs:7.4 nC @ 5 V
  • Vgs (Max):+6V, -4V
  • Input Capacitance (Ciss) (Max) @ Vds:851 pF @ 50 V
  • FET Feature:-
  • Power Dissipation (Max):-
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Supplier Device Package:Die
  • Package / Case:Die

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EPC2204

Overview

The EPC2204 is an enhancement-mode Gallium Nitride Field-Effect Transistor (eGaN FET) manufactured by Efficient Power Conversion. It features a 100 V drain-to-source breakdown voltage and a low on-resistance, providing an optimal trade-off between RDS(on) and COSS for hard-switching applications. The device utilizes a compact chip-scale package that minimizes PCB footprint and current loop inductance to reduce electromagnetic interference.

Feature Summary

  • Achieves optimal balance between low on-resistance and output capacitance for demanding hard-switching environments
  • Utilizes a compact chip-scale package to significantly reduce printed circuit board area and current loop size
  • Minimizes electromagnetic interference through reduced parasitic inductance inherent in the small form factor

Applications

  • Solar MPPT charging converters
  • Green solar balcony power generation systems
  • High-efficiency DC-DC conversion circuits

Procurement Notes

Verify the specific datasheet revision and electrical characteristics against the official Efficient Power Conversion documentation before integration. Confirm that the component meets the required thermal management specifications for the intended application environment. Ensure compatibility with existing gate drive requirements for eGaN devices.

Selection Notes

Select this component when high efficiency and minimal physical size are critical constraints in power conversion designs. The device is suitable for applications requiring robust performance in hard-switching topologies where low switching losses and reduced electromagnetic emissions are prioritized over higher voltage ratings.

Part Context

This component belongs to the eGaN family of power transistors designed for high-frequency operation. It leverages Gallium Nitride technology grown on silicon wafers using standard CMOS equipment infrastructure. The device architecture provides zero reverse recovery charge, contributing to superior efficiency compared to traditional silicon MOSFETs in similar voltage classes.

FAQ

What is the primary advantage of the EPC2204 package type?

The chip-scale package allows for a significantly smaller PCB footprint and minimized current loops, which helps reduce electromagnetic interference.

How does the EPC2204 handle reverse recovery?

As an eGaN FET, it exhibits zero reverse recovery charge, eliminating associated switching losses and improving overall system efficiency.

EPC2204EPC2204
$2.75
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