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The F3L100R07W1H5FB67BPSA1 is a silicon IGBT module from Infineon Technologies, belonging to the EasyPACK 2B series. It features a 650 V collector-emitter voltage rating and a continuous collector current of 70 A at 25°C. The device utilizes trench-stop technology for efficient switching. Key electrical parameters include a collector-emitter saturation voltage of 1.68 V and a gate-emitter leakage current of 100 nA. It operates within a temperature range of -40°C to +150°C and is supplied in tray packaging.
Verify the specific suffix B67 against the official datasheet to confirm pinout and terminal configuration compatibility with your PCB layout. Ensure thermal interface material selection matches the EasyPACK 2B baseplate requirements. Cross-reference the full part number with Infineon's official documentation to avoid confusion with similar variants in the F3L100R07W series that may have different saturation voltages or packaging options.
Select this component when a 650 V rating and 70 A continuous current are required for three-phase topologies. The EasyPACK 2B form factor facilitates integration into standard industrial designs. Consider the 1.68 V saturation voltage for conduction loss calculations. Verify that the operating junction temperature limits align with the system's thermal design constraints and that the gate drive requirements match the specified leakage and threshold characteristics.
This module is part of Infineon's broader EasyPACK family, which provides standardized mechanical dimensions for power modules. The F3L100R07W1H5FB67BPSA1 specifically targets high-efficiency applications requiring robust switching performance. It complements other devices in the 650 V silicon IGBT portfolio, offering a balance between cost and performance for medium-power industrial applications.
Direct substitutes within the same series include F3L100R07W2H3B11BPSA1 and F3L100R07W3S5B11BPSA1, though these may exhibit different saturation voltages or packaging details. Always verify electrical parameters and mechanical footprints before substitution.