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Product Detailed Parameters
- Description：LOW POWER EASY AG-EASY4B-7011
- Series：EasyPACK™
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Level Inverter
- Vce(on) (Max) @ Vge, Ic：2.25V @ 15V, 400A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-EASY4B
- Voltage - Collector Emitter Breakdown (Max)：950 V
- Current - Collector (Ic) (Max)：310 A
- Power - Max：-
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：49.2 nF @ 25 V
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Overview
The F3L600R10W4S7FC22BPSA1 is a 950 V, 600 A three-level IGBT module in the EasyPACK™ 4B package. It integrates TRENCHSTOP™ IGBT7 chips and CoolSiC™ Schottky diodes (Gen 5). Key electrical ratings include an implemented collector current of 600 A with a repetitive peak of 800 A for IGBTs, and continuous forward currents up to 300 A for standard diodes. The module features PressFIT contact technology and an integrated NTC temperature sensor. Operating junction temperatures range from -40 °C to 150 °C.
Feature Summary
- Utilizes TRENCHSTOP™ IGBT7 micro-pattern trench technology for optimized switching performance.
- Incorporates CoolSiC™ Schottky diode generation 5 to minimize reverse recovery losses.
- Features PressFIT terminal connection technology for robust mechanical mounting.
- Includes an integrated NTC thermistor for precise internal temperature monitoring.
Applications
- Three-level solar applications
- ANPC topology for 1500V DC photovoltaic string inverters
Procurement Notes
Verify component authenticity by cross-referencing the manufacturer's part number and ordering suffix against official Infineon documentation. Ensure the specific C22 suffix matches the required CoolSiC diode configuration. Confirm compliance with industrial qualification standards such as IEC 60747 and IEC 60068 prior to integration into critical power systems.
Selection Notes
Select this module for high-power density designs requiring low switching losses in three-level topologies. The EasyPACK™ 4B form factor allows for direct system upgrades while maintaining a 12 mm height profile. Consider the thermal resistance values and gate resistor requirements specified in the datasheet when designing the cooling solution and driver circuitry for optimal efficiency.
Part Context
This component belongs to the EasyPACK™ series, specifically the 4B variant designed for advanced three-level applications. It represents the integration of seventh-generation silicon IGBT technology with fifth-generation silicon carbide diodes, targeting high-efficiency renewable energy conversion systems.
Replacement Considerations
Direct replacements within the same family include variants with different current ratings or diode types. Verify pin compatibility and thermal characteristics before substituting. Consult the official selection guide for equivalent modules with adjusted voltage or current specifications.
