F417MR12W1M1HB76BPSA1

$86.66

Description：LOW POWER EASY
Series：-

SKU:648dbf2f63d5 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER EASY
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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F417MR12W1M1HB76BPSA1

Overview

The F417MR12W1M1HB76BPSA1 is a CoolSiC™ Trench MOSFET module in the EasyPACK™ package. It features a 1200 V drain-source voltage and a continuous DC drain current of 45 A at 175 °C junction temperature. The on-state resistance is 16.2 mΩ at 25 °C, rising to 34.7 mΩ at 175 °C. Switching losses include turn-on energy of 0.773 mJ and turn-off energy of 0.186 mJ at 25 °C. The module integrates an NTC thermistor with a rated resistance of 5 kΩ at 25 °C.

Feature Summary

Integrated NTC temperature sensor for thermal monitoring
PressFIT contact technology for secure mounting
Rugged design with integrated mounting clamps

Applications

Welding
DC charger for EV
DC/DC converter
High-frequency switching application

Procurement Notes

Verify the component against the official Infineon datasheet IFX-ABC098-002. Confirm that the ordering suffix B76 corresponds to the EasyPACK™ package with PressFIT contacts and NTC integration. Ensure the specific revision matches the required electrical characteristics before procurement.

Selection Notes

Select this module for applications requiring high current density and low switching losses. Verify that the gate drive voltages align with the recommended window of 15 to 18 V for positive and -5 to 0 V for negative states. Consider the thermal resistance of 1.09 K/W when designing the heatsink interface.

Part Context

This part belongs to the CoolSiC™ M1H series from Infineon Technologies. It utilizes silicon carbide trench MOSFET technology within the EasyPACK™ form factor. The module is designed for industrial applications and validated according to IEC standards for reliability.

Replacement Considerations

Check for other variants within the F4-17MR12W1M1H family. Substitutes must match the 1200 V rating, 50 A nominal current, and EasyPACK™ mechanical footprint. Verify if alternative ordering suffixes provide identical electrical parameters or different packaging options.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.