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The F475R06W1E3BOMA1 is a six-pack IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT3 technology. It features integrated emitter-controlled diodes and an NTC thermistor within the EasyPACK housing. The collector-emitter voltage (VCES) is rated at 600 V, with a nominal continuous DC collector current (IC nom) of 75 A at TC = 80°C. The repetitive peak collector current (ICRM) reaches 150 A for 1 ms pulses. The module exhibits low switching losses and a compact design suitable for high-power industrial applications.
Verify the specific ordering suffix BOMA1 against official documentation to confirm exact configuration details. Ensure compatibility with standard EasyPACK mounting requirements. Confirm RoHS compliance status through the manufacturer's latest release notes before finalizing procurement orders.
Select this module for applications requiring 600 V blocking capability and up to 75 A continuous current. Evaluate thermal resistance values (RthJC) against the system heatsink design. Consider the 20 nH module stray inductance when designing gate drive circuits and PCB layouts to optimize switching performance.
This component belongs to the F4-75R series of EasyPACK modules. It represents the third generation of Trench/Fieldstop IGBT technology. The product line focuses on balancing low conduction losses with fast switching capabilities for efficient power conversion in industrial environments.
Direct replacements include other Infineon EasyPACK modules with matching 600V ratings and similar pinouts. Verify thermal characteristics and package dimensions before substituting. Cross-reference datasheets for equivalent current handling and switching energy values.