F48MR12W2M1HB70BPSA1

$154.11

Description：LOW POWER EASY
Series：-

SKU:e715fddf3df9 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER EASY
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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F48MR12W2M1HB70BPSA1

Overview

The F48MR12W2M1HB70BPSA1 is a CoolSiC™ MOSFET half-bridge module in the EasyPACK™ package. It features a 1200 V drain-source voltage and a continuous DC drain current of 100 A at 175 °C junction temperature, with a repetitive peak current rating of 200 A. The on-state resistance is typically 8.1 mΩ at 25 °C. The module utilizes PressFIT contact technology and includes an integrated NTC thermistor for thermal monitoring. It employs an AlN substrate to achieve low thermal resistance.

Feature Summary

Low inductive design architecture
Integrated NTC temperature sensor
PressFIT contact technology
AlN substrate with low thermal resistance

Applications

High-frequency switching applications
DC/DC converters
UPS systems
EV DC chargers

Procurement Notes

Verify the specific ordering suffix B70 against official Infineon documentation to confirm exact manufacturing lot codes and compliance status. Ensure that gate driver selection aligns with the recommended operating voltages specified in the datasheet. Confirm mechanical mounting force requirements match the application constraints before procurement.

Selection Notes

Select this component for high-density power conversion designs requiring low switching losses. Evaluate the thermal management strategy based on the provided RthJH value. Verify that the system's maximum operating temperature remains within the -40 °C to +175 °C range. Consider the stray inductance value when designing PCB layouts for optimal performance.

Part Context

This part belongs to the Infineon CoolSiC™ M1H series, utilizing Trench MOSFET technology. It is designed as a direct replacement or upgrade for silicon-based modules in high-efficiency applications. The EasyPACK™ form factor ensures compatibility with standard mounting solutions used in industrial power electronics.

Replacement Considerations

Consult the official cross-reference list for verified substitutes. Ensure any alternative maintains equivalent voltage ratings, current capabilities, and thermal characteristics.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.