FAB2200UCX

FAB2200UCX

$0.81
  • Description:AUDIO AMPLIFIER
  • Series:-
  • Mfr:Fairchild Semiconductor
  • Package:Bulk

SKU:7a833413149f Category: Brand:

  
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Product Detailed Parameters

  • Description:AUDIO AMPLIFIER
  • Series:-
  • Mfr:Fairchild Semiconductor
  • Package:Bulk
  • Type:Class D, Class G
  • Output Type:1-Channel (Mono) with Stereo Headphones
  • Max Output Power x Channels @ Load:1.2W x 1 @ 8Ohm; 41mW x 2 @ 32Ohm
  • Voltage - Supply:2.8V ~ 5.25V
  • Features:Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Shutdown, Volume Control
  • Mounting Type:Surface Mount
  • Supplier Device Package:25-WLCSP (2.4x2)
  • Package / Case:25-UFBGA, WLCSP
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Grade:-
  • Qualification:-

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FAB2200UCX

Overview

The FAB2200UCX is a stereo audio subsystem integrating a Class-G headphone amplifier and a Class-D speaker amplifier. It delivers 1.2W per channel for stereo output in a compact 25-WLCSP package measuring 2.4x2 mm. The device supports low-voltage operation suitable for portable consumer electronics, combining high-efficiency amplification with integrated control features to optimize battery life and audio fidelity in mobile applications.

Feature Summary

  • Integrates stereo Class-G headphone amplifier and mono Class-D speaker amplifier
  • Compact 25-WLCSP package design for space-constrained devices
  • Optimized for low-voltage portable consumer electronics

Applications

  • Mobile phone audio subsystems
  • Portable media players
  • Smartphones with integrated audio capabilities

Procurement Notes

Verify the manufacturer origin as Fairchild Semiconductor, now part of ON Semiconductor, given corporate acquisitions. Confirm the specific package variant matches the 25-WLCSP (2.4x2) specification. Ensure RoHS3 compliance status aligns with current regulatory requirements for your target market. Cross-reference the full part number to distinguish from similar models like the FAB2210UCX.

Selection Notes

Select this component when a single IC solution is required for both headphone and speaker outputs in mobile devices. The integration reduces board space compared to discrete amplifier designs. Consider the 25-WLCSP footprint for dense PCB layouts. Verify voltage compatibility with the target system's power supply rails before implementation.

Part Context

This audio subsystem belongs to Fairchild's portfolio of integrated audio solutions designed for mobile handsets. It consolidates multiple amplifier functions into one chip to simplify design and reduce component count. The product line targets the consumer electronics sector, specifically devices requiring efficient audio processing within strict size constraints.

Replacement Considerations

The FAB2210UCX is a related model within the same family. Verify functional equivalence regarding channel configuration and power output before substitution. Check pinout compatibility to ensure direct replacement feasibility without circuit redesign.

FAB2200UCXFAB2200UCX
$0.81
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