FB50R07W2E3B23BOMA1

FB50R07W2E3B23BOMA1

$35.77
  • Description:LOW POWER EASY AG-EASY2B-2
  • Series:-

SKU:99f74f2e9c86 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:LOW POWER EASY AG-EASY2B-2
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • IGBT Type:-
  • Configuration:-
  • Vce(on) (Max) @ Vge, Ic:-
  • Input:-
  • NTC Thermistor:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):-
  • Current - Collector (Ic) (Max):-
  • Power - Max:-
  • Current - Collector Cutoff (Max):-
  • Input Capacitance (Cies) @ Vce:-

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FB50R07W2E3B23BOMA1

Overview

The FB50R07W2E3B23BOMA1 is a Power Integrated Module (PIM) from Infineon's EasyPIM series, utilizing Trench/Fieldstop IGBT3 technology. It integrates three-phase inverter IGBTs and diodes, a boost circuit with an IGBT and diode, a rectifier bridge, and a reverse diode. Key electrical parameters include a collector-emitter voltage of 650 V, implemented nominal current of 50 A, and repetitive peak current of 100 A. The module features PressFIT contact technology for mounting.

Feature Summary

  • Integrates fast Trench/Fieldstop IGBT3 and emitter-controlled diodes within a single compact package.
  • Utilizes Al2O3 substrate to provide low thermal resistance and efficient heat dissipation.
  • Incorporates PressFIT contact technology combined with integrated mounting clamps for rugged installation.

Applications

  • Air conditioning systems

Procurement Notes

Verify the specific ordering suffix BOMA1 against official documentation to confirm exact configuration details. Ensure that the selected component meets all industrial qualification requirements defined by relevant IEC standards before finalizing procurement specifications.

Selection Notes

Select this module for applications requiring a complete power stage solution including inversion, boosting, and rectification. Consider the 650 V rating and 50 A nominal current limits when designing the thermal management system to ensure operation within the specified junction temperature range.

Part Context

This component belongs to the EasyPIM family, which consolidates multiple power semiconductor functions into a single unit. It is designed to simplify the design process for motor drives and power conversion systems by reducing component count and assembly complexity compared to discrete solutions.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing PCB layouts and thermal interfaces if considering alternative PIM architectures.

FB50R07W2E3B23BOMA1FB50R07W2E3B23BOMA1
$35.77
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