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FDMC6675BZ is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET P-CH 30V 9.5A/20A 8MLP. Review the specifications below when checking this part for your BOM.
The FDMC6675BZ is a P-channel enhancement-mode MOSFET from the PowerTrench series by onsemi. It features a maximum drain-source voltage of 30 V and a continuous drain current of 40 A. The device utilizes an MLP surface-mount package with eight pins, measuring 3.3 mm by 3.3 mm with a height of 0.75 mm. Key electrical characteristics include a maximum on-resistance of 27 mΩ and a typical gate charge of 46 nC at 10 V. It operates within a temperature range of -55 °C to +150 °C and has a maximum power dissipation of 36 W.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and check for specific environmental declarations required by your region. Ensure the ordering suffix matches the exact package and tape-and-reel specifications needed for your assembly process. Review the latest datasheet revision for any updates to mechanical dimensions or electrical limits before finalizing procurement.
Select this component when a 30 V P-channel MOSFET with high current capability is required. The 40 A rating and low Rds(on) make it suitable for power-intensive applications. Consider the MLP package size constraints and thermal management requirements for your design. Verify that the gate drive voltage levels are compatible with the specified threshold and maximum ratings.
This part belongs to onsemi's PowerTrench family of discrete power MOSFETs. These devices are engineered for high-efficiency power switching applications. The FDMC6675BZ specifically targets designs requiring robust P-channel performance in a small footprint. It complements other components in power supply and motor control architectures.
Consult official substitution guides for verified alternatives. Cross-reference pinouts and electrical parameters carefully. Ensure any substitute maintains compatibility with the existing PCB layout and thermal design constraints.
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