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FDMS3615S is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET 2N-CH 25V 16A/18A POWER56. Review the specifications below when checking this part for your BOM.
The FDMS3615S is a dual N-Channel PowerTrench MOSFET manufactured by onsemi. It utilizes enhancement mode technology within a Power-56-8 surface-mount package. The device features a drain-source breakdown voltage (Vds) of 25 V and a gate-source voltage range of ±20 V. Continuous drain current (Id) ratings are specified at 16 A and 18 A, with corresponding on-resistance (Rds(on)) values of 5.8 mΩ and 3.4 mΩ. Gate charge (Qg) ranges from 19 nC to 31 nC, while fall times vary between 1.4 ns and 2.2 ns. The component operates within a temperature range of -55°C to +150°C, with power dissipation capabilities of 1 W and 2.3 W.
Verify the specific ordering suffix and revision level against the official datasheet to ensure compatibility with design requirements. Confirm RoHS compliance status through manufacturer documentation. Check availability as the product lifecycle status may indicate end-of-life or limited supply conditions. Validate package dimensions and pinout against ECAD models before finalizing procurement plans.
Select this component based on the required 25 V rating and dual-channel topology. Evaluate thermal management needs considering the specified power dissipation limits in the Power-56-8 package. Compare gate charge and on-resistance values against system efficiency targets. Ensure the driving circuit can support the required gate voltage levels and switching speeds for optimal performance.
The FDMS3615S belongs to onsemi's PowerTrench series, designed for high-efficiency power conversion. It shares the Power-56-8 package form factor with other devices in the family, facilitating board layout standardization. This dual MOSFET structure supports compact designs in portable and computing power applications requiring synchronized switching.
Consult the official datasheet for direct pin-compatible alternatives within the same package. Verify electrical parameters such as Rds(on), Vds, and Qg match or exceed original specifications. Ensure thermal characteristics and package dimensions remain compatible with existing footprints.
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