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FF33MR12W1M1HB11BPSA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET. Review the specifications below when checking this part for your BOM.
The FF33MR12W1M1HB11BPSA1 is a half-bridge module utilizing CoolSiC Trench MOSFET technology. It features a 1200 V drain-source voltage rating and supports a continuous DC drain current of 25 A at 175 °C junction temperature, with a repetitive peak current capability of 50 A. The device incorporates PressFIT contact technology for mounting and includes an integrated NTC temperature sensor. Electrical characteristics include a typical on-resistance of 32.3 mΩ at 25 °C and low stray inductance of 18 nH.
Verify the component against the official Infineon datasheet IFX-ABE750-002 (Revision 0.20) to confirm technical specifications. Ensure that the ordering suffix BPSA1 corresponds to the specific packaging and marking requirements required for your assembly process. Cross-reference the module label code format to validate authenticity upon receipt.
Select this module for designs requiring high efficiency and compact size in power conversion circuits. The 1200 V rating and 25 A continuous current capacity are suitable for industrial power supplies. Consider the thermal resistance and operating temperature range when designing the heatsink interface. Verify gate drive voltage compatibility with the recommended 15 V to 18 V on-state level.
This component belongs to the EasyDUAL series from Infineon Technologies. It is part of the broader CoolSiC product family designed for advanced power electronics. The module integrates silicon carbide semiconductor technology within a standardized package form factor to facilitate integration into various industrial power modules and inverters.
Consult the official datasheet for potential substitute part numbers or alternative configurations within the EasyDUAL series. Verify pinout compatibility and electrical ratings before substituting any other discrete modules or half-bridge assemblies.
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