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Product Detailed Parameters
- Description：MEDIUM POWER 62MM
- Series：C, TRENCHSTOP™
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：1.75V @ 15V, 450A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-62MMHB
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：450 A
- Power - Max：-
- Current - Collector Cutoff (Max)：100 µA
- Input Capacitance (Cies) @ Vce：70800 pF @ 25 V
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Overview
The FF450R12KE7PEHPSA1 is a dual common emitter IGBT module from Infineon Technologies, rated at 1200 V and 450 A. It utilizes TrenchStop™ technology for optimized switching performance. The module features a collector-emitter saturation voltage of 1.5 V and a maximum gate-emitter voltage of 20 V. Operating within a temperature range of -40 °C to +175 °C, it employs screw mount installation in a compact package measuring 62 mm x 62 mm.
Feature Summary
- Integrates TrenchStop™ IGBT7 technology for enhanced efficiency and reliability
- Features a half-bridge configuration with common emitter topology
- Includes integrated NTC thermistor for precise thermal monitoring
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific ordering suffix against official Infineon documentation to ensure correct technical specifications. Confirm that the component matches the required electrical ratings and thermal characteristics for the intended application before finalizing procurement orders.
Selection Notes
Select this module for applications requiring high current density and robust thermal management. Consider the 1.5 V saturation voltage for conduction loss calculations. Ensure the cooling solution supports the specified operating temperature range and mounting requirements for optimal performance.
Part Context
This component belongs to the EconoPACK™3 series, designed for high-power density applications. It combines advanced semiconductor technology with a compact form factor, suitable for space-constrained industrial environments requiring reliable power conversion solutions.
Replacement Considerations
Consult official Infineon substitution guides for compatible alternatives. Verify pin compatibility and thermal interface requirements when considering cross-references to ensure seamless integration without redesigning the host system.
