FF450R33T3E3BPSA1

$1,090.55

Description：IGBT MOD 3300V 450A AGXHP100-3
Series：XHP™3

SKU:55ad5932c68f Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MOD 3300V 450A AGXHP100-3
Series：XHP™3
Mfr：Infineon Technologies
Package：Bulk,Tray
IGBT Type：Trench Field Stop
Configuration：Half Bridge
Vce(on) (Max) @ Vge, Ic：2.75V @ 15V, 450A
Input：Standard
NTC Thermistor：No
Operating Temperature：-40°C ~ 150°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：AG-XHP100-3
Voltage - Collector Emitter Breakdown (Max)：3300 V
Current - Collector (Ic) (Max)：450 A
Power - Max：1000000 W
Current - Collector Cutoff (Max)：5 mA
Input Capacitance (Cies) @ Vce：-

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FF450R33T3E3BPSA1

Overview

The FF450R33T3E3BPSA1 is a dual IGBT module from Infineon's XHP™3 series, utilizing Trench/Fieldstop IGBT3 and emitter controlled diode 3 technologies. It features a collector-emitter voltage (VCES) of 3300 V and a continuous DC collector current (ICDC) of 450 A at a case temperature of 100°C. The module operates with a junction temperature range of -40°C to +150°C and includes an AlSiC base plate for enhanced thermal cycling capability.

Feature Summary

High short-circuit capability and robustness
Positive temperature coefficient for VCE,sat
Isolated base plate with high comparative tracking index

Applications

Medium-voltage converters
Motor drives
Traction drives
UPS systems
Wind turbines

Procurement Notes

Verify the specific ordering suffix BPSA1 against the official datasheet to confirm exact packaging and labeling specifications. Ensure compliance with export documentation requirements if sourcing from restricted regions. Confirm that the component meets industrial qualification standards per IEC 60747, 60749, and 60068 before integration into final designs.

Selection Notes

Select this module for applications requiring high power density and medium-voltage operation up to 3300 V. Consider the positive temperature coefficient of VCE,sat for reliable parallel operation without active current sharing circuits. Evaluate the thermal resistance values provided in the datasheet to design appropriate heat sinking solutions for the target operating environment.

Part Context

This component belongs to Infineon's XHP™3 product family, designed for industrial and traction applications. It represents an evolution in IGBT technology, combining high breakdown voltage capabilities with improved switching performance and thermal stability compared to previous generations.

Replacement Considerations

Direct replacements within the same voltage and current class include other XHP3 modules such as FF450R33ME3 or FF450R33KE3 variants. Verify pin compatibility and thermal characteristics when substituting.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.