FF55MR12W1M1HB11BPSA1

Power Driver Modules Overview

The FF55MR12W1M1HB11BPSA1 is a CoolSiC™ Trench MOSFET half-bridge module in the EasyDUAL package. It features a 1200 V drain-source voltage and a continuous DC drain current of 15 A at 175 °C junction temperature. The device incorporates PressFIT contact technology for rugged mounting and includes an integrated NTC thermistor with a rated resistance of 5 kΩ at 25 °C. Key electrical parameters include a maximum on-resistance of 114 mΩ at 175 °C, a gate threshold voltage ranging from 3.45 V to 5.15 V, and a total gate charge of 0.045 µC.

Power Driver Modules Feature Summary

• Utilizes CoolSiC™ Trench MOSFET technology for low switching losses and high-frequency operation.
• Features PressFIT contact technology combined with integrated mounting clamps for secure mechanical connection.
• Includes an integrated NTC temperature sensor for precise thermal monitoring.
• Designed with a low-inductive structure to minimize stray inductance during switching.

Power Driver Modules Applications

• High-frequency switching applications
• DC/DC converters
• Motor drives
• UPS systems

Power Driver Modules Procurement Notes

Verify component authenticity by cross-referencing the unique serial number and material code printed on the module label against official Infineon records. Confirm that the datasheet revision matches the specific batch requirements. Ensure the ordering suffix corresponds exactly to the required configuration, as variations may exist within the product family. Request relevant compliance documentation directly from authorized channels prior to finalizing acquisition.

Power Driver Modules Selection Notes

Select this module for designs requiring robust press-fit integration and active thermal management via the built-in NTC sensor. Evaluate the thermal resistance characteristics against the system's heat sink capabilities to ensure junction temperatures remain within the specified operational limits. Consider the gate charge and internal resistance values when designing the driver circuitry to optimize switching performance and minimize power dissipation.

Power Driver Modules Part Context

This component belongs to the EasyDUAL series of discrete semiconductor modules manufactured by Infineon Technologies. It utilizes silicon carbide (SiC) technology to deliver enhanced efficiency compared to traditional silicon devices. The module is designed for industrial applications and complies with relevant IEC standards for insulation coordination and environmental testing.

Power Driver Modules Replacement Considerations

Consult official Infineon documentation for qualified substitute part numbers. Verify compatibility regarding pinout, thermal resistance, and electrical ratings before implementing any alternative components in existing designs.

Power Driver Modules FAQ

What is the purpose of the integrated NTC thermistor?

The integrated NTC thermistor provides real-time temperature monitoring of the module, allowing for precise thermal management and protection against overheating.

How does the PressFIT technology benefit the module installation?

PressFIT technology ensures a rugged and reliable mechanical connection without soldering, reducing assembly time and enhancing durability under vibration and thermal cycling.

What is the maximum operating junction temperature?

The maximum operating junction temperature for the MOSFET is 175 °C, allowing for operation under overload conditions as specified in application notes.