FF600R17ME4B11BPSA1

Overview

The FF600R17ME4B11BPSA1 is an EconoDUAL™3 half-bridge IGBT module featuring Trench/Fieldstop IGBT4 technology and an emitter-controlled diode. It supports a collector-emitter voltage of 1700 V with a nominal continuous DC collector current of 600 A and a repetitive peak current of 1200 A. The module integrates a 5 kΩ NTC thermistor for thermal monitoring. Key electrical parameters include a typical saturation voltage of 1.95 V at 25°C, a forward voltage of 1.80 V for the diode, and a gate charge of 6.15 µC. Thermal resistance from junction to case is 0.0369 K/W for the IGBT and 0.0730 K/W for the diode. The unit weighs 345 g and operates within a junction temperature range of -40°C to 150°C.

Feature Summary

• High power density design utilizing Trench/Fieldstop IGBT4 technology
• Integrated PressFIT terminals for reliable board mounting
• Built-in NTC thermistor for precise thermal management
• Isolated copper base plate with basic insulation

Applications

• High-power converters
• Wind turbines

Procurement Notes

Verify the specific B11 suffix against official Infineon documentation to confirm terminal connection type and packaging configuration. Ensure that the selected gate driver is compatible with the module's electrical requirements as listed in the manufacturer's guide. Confirm compliance with industrial qualification standards such as IEC 60747 and IEC 60068 prior to integration into the final system design.

Selection Notes

Select this component for applications requiring high current density and low saturation voltage. Evaluate the thermal resistance values to ensure adequate heat sinking for the intended operating conditions. Verify that the PCB hole pattern matches the EconoDUAL™3 mechanical outline. Consider the positive temperature coefficient of the saturation voltage for parallel operation stability.

Part Context

This part belongs to the Infineon EconoDUAL™3 series, which utilizes Trenchstop IGBT4 technology. The module is designed for industrial applications and features a standard housing with an isolated base plate. It represents a mature product line optimized for high-power conversion systems where reliability and compact form factors are critical.

Replacement Considerations

Consult official Infineon cross-reference lists for verified substitutes. Ensure any replacement maintains identical voltage ratings, current capabilities, and mechanical dimensions. Verify compatibility with existing gate drivers and cooling solutions before implementation.