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Product Detailed Parameters
- Description：EASY STANDARD
- Series：TRENCHSTOP™
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge Inverter
- Vce(on) (Max) @ Vge, Ic：1.8V @ 15V, 75A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-EASY1B
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：65 A
- Power - Max：20 mW
- Current - Collector Cutoff (Max)：5.6 µA
- Input Capacitance (Cies) @ Vce：15100 pF @ 25 V
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Overview
The FF75R12W1T7EB11BPSA1 is an EasyDUAL IGBT module featuring TRENCHSTOP™ IGBT7 technology and emitter-controlled diodes. It provides a collector-emitter voltage of 1200 V, a nominal current of 75 A, and a repetitive peak current of 150 A. The continuous DC collector current reaches 65 A at 175°C junction temperature. Saturation voltage is 1.55 V typ at 25°C. Operating temperature spans -40°C to +175°C. It utilizes PressFIT contact technology and includes an integrated NTC thermistor with 5 kΩ resistance at 25°C.
Feature Summary
- Integrates TRENCHSTOP™ IGBT7 and emitter controlled 7 diode for optimized switching performance
- Features PressFIT contact technology for reliable connection without soldering
- Includes integrated NTC temperature sensor for thermal monitoring
- Utilizes Al2O3 substrate with low thermal resistance for high power density
Applications
- Motor drives
- Air conditioning systems
- Auxiliary inverters
- Servo drives
- UPS systems
Procurement Notes
Verify the component against official Infineon datasheets to confirm technical specifications and compliance standards. Ensure that the ordering suffix matches the required configuration, as variations may exist within the product family. Cross-reference part numbers with authorized distributors to validate authenticity and traceability before finalizing procurement decisions.
Selection Notes
Select this module for applications requiring high power density and robust thermal management. The PressFIT mounting style eliminates soldering requirements, simplifying assembly processes. Consider the 175°C operating capability for overload conditions. Verify gate driver compatibility using the manufacturer's GDFinder tool to ensure optimal switching performance and system reliability.
Part Context
This component belongs to the EasyDUAL module series from Infineon Technologies. It is designed for industrial applications and qualified according to IEC 60747, 60749, and 60068 standards. The module combines IGBT and diode chips on a single substrate, offering a compact solution for inverter circuits in various power electronics systems.
Replacement Considerations
Consult official Infineon documentation for confirmed substitute part numbers. Do not assume cross-compatibility with other modules based solely on similar ratings. Verify mechanical dimensions, pin configurations, and electrical characteristics before considering any alternative components.
