FF800R12KF4

FF800R12KF4

  • Description:IGBT MOD 1200V 800A 5000W
  • Series:-

SKU:8ce2f8d354ab Category: Brand:

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Product Detailed Parameters

  • Description:IGBT MOD 1200V 800A 5000W
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:-
  • Configuration:2 Independent
  • Vce(on) (Max) @ Vge, Ic:3.2V @ 15V, 800A
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:Module
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):800 A
  • Power - Max:5000 W
  • Current - Collector Cutoff (Max):16 mA
  • Input Capacitance (Cies) @ Vce:55 nF @ 25 V

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FF800R12KF4

Overview

The FF800R12KF4 is a half-bridge IGBT module from Infineon Technologies, rated for 1200 V collector-emitter voltage and 800 A DC collector current. It features a repetitive peak collector current of 1600 A and a total power dissipation of 5000 W at 25°C case temperature. The module utilizes an aluminum oxide internal insulation and operates within a junction temperature range up to 150°C. Key electrical characteristics include a typical collector-emitter saturation voltage of 2.7 V at 25°C and a forward voltage of 2.2 V for the inverse diode. Thermal resistance from junction to case is specified at 0.0125 °C/W for the transistor.

Feature Summary

  • Half-bridge configuration with integrated inverse diode
  • Aluminum oxide internal insulation for enhanced reliability
  • High short-circuit robustness with defined protection conditions
  • Positive temperature coefficient for collector-emitter saturation voltage

Applications

  • High-power industrial converters
  • Motor drive systems
  • Uninterruptible power supply (UPS) units
  • Wind turbine generators

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and specific ordering suffixes against official datasheets. Ensure proper handling procedures are followed due to the sensitivity of semiconductor components. Request detailed technical documentation and application notes prior to integration into final designs.

Selection Notes

Evaluate thermal management requirements based on the specified junction-to-case thermal resistance. Ensure gate drive circuits can accommodate the ±20 V peak gate-emitter voltage limits. Verify that the cooling system maintains the case temperature within the operational range of -40°C to +125°C. Consider the switching energy losses at the intended operating frequency and load conditions.

Part Context

This component belongs to the KF4 series of IGBT modules, designed for high-power applications requiring robust performance. It represents a specific configuration within Infineon's portfolio, offering a balance of current handling capability and voltage rating suitable for demanding industrial environments.

Replacement Considerations

Direct substitutes must match the 1200 V / 800 A rating and half-bridge topology. Verify pin compatibility and mechanical dimensions before substitution. Consult official replacement lists for updated generations with improved thermal or electrical characteristics.

FF800R12KF4FF800R12KF4

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