FF8MR12W1M1HS4PB11BPSA1

FET, MOSFET Arrays Overview

The FF8MR12W1M1HS4PB11BPSA1 is a CoolSiC Trench MOSFET EasyDUAL module featuring a 1200 V drain-source voltage and an 8.1 mΩ on-resistance at 25°C. It supports a continuous DC drain current of 100 A and a repetitive peak current of 200 A. The device integrates PressFIT contact technology, pre-applied thermal interface material, and an NTC temperature sensor with a rated resistance of 5 kΩ. Key electrical parameters include a gate threshold voltage ranging from 3.45 V to 5.15 V and a maximum operating junction temperature of 150°C.

FET, MOSFET Arrays Feature Summary

• Utilizes low inductive design and CoolSiC Trench MOSFET technology for reduced switching losses.
• Incorporates PressFIT contact technology combined with integrated mounting clamps for rugged installation.
• Features an integrated NTC thermistor for precise internal temperature monitoring.
• Includes pre-applied thermal interface material to simplify assembly and ensure reliable heat dissipation.

FET, MOSFET Arrays Applications

• High-frequency switching applications
• DC/DC converters
• Uninterruptible Power Supply (UPS) systems
• Electric vehicle (EV) DC chargers

FET, MOSFET Arrays Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm mechanical and electrical configurations. Ensure compatibility with recommended gate drive voltages and thermal management requirements. Confirm that the application environment meets the specified industrial qualification standards defined in IEC 60747, 60749, and 60068 before finalizing procurement decisions.

FET, MOSFET Arrays Selection Notes

Select this module for designs requiring high-voltage capability and low conduction losses in compact power stages. Consider the 1200 V rating and 100 A continuous current capacity when sizing thermal solutions. Evaluate the integration of the NTC sensor and PressFIT contacts to determine if they align with the system's assembly infrastructure and monitoring needs.

FET, MOSFET Arrays Part Context

This component belongs to the Infineon CoolSiC EasyDUAL family, designed for robust power conversion. It utilizes silicon carbide technology to achieve superior performance compared to traditional silicon devices. The module format facilitates easy integration into various power electronics architectures through standardized mounting and contact interfaces.

FET, MOSFET Arrays Replacement Considerations

Consult official Infineon replacement guides for verified substitutes. Cross-reference key parameters such as voltage rating, current capacity, and package dimensions to ensure functional equivalence without compromising system reliability or safety margins.

FET, MOSFET Arrays FAQ

What is the maximum operating junction temperature for this module?

The maximum operating junction temperature is 150°C.

Does the module include an integrated temperature sensor?

Yes, it features an integrated NTC thermistor with a rated resistance of 5 kΩ at 25°C.

What type of contact technology does this module use?

It utilizes PressFIT contact technology for secure and reliable connection.