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Product Detailed Parameters
- Description：IGBT MODULE LOW POWER EASY
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：-
- Vce(on) (Max) @ Vge, Ic：-
- Input：-
- NTC Thermistor：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Power - Max：-
- Current - Collector Cutoff (Max)：-
- Input Capacitance (Cies) @ Vce：-
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Overview
The FF8MR12W2M1PB11BPSA1 is a discrete semiconductor module manufactured by Infineon Technologies. It is classified as an IGBT module within the Low Power Easy series, utilizing Silicon technology. The component features a dual configuration and is designed for press-fit installation in a module package. Key electrical specifications include a drain-source breakdown voltage of 1.2 kV, a continuous drain current of 150 A, and a drain-source on-resistance of 7.5 mOhms. The gate-source voltage rating is +15 V with a threshold voltage of 3.45 V. Operating temperatures range from -40 C to +150 C, with a power dissipation of 20 mW.
Feature Summary
- Utilizes CoolSiC MOSFET technology integrated into the EasyDUAL and PressFIT product lines.
- Features a dual configuration suitable for half-bridge applications.
- Designed for press-fit mounting to facilitate assembly.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Solar inverters
Procurement Notes
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status via official documentation. Check for end-of-life notifications or production discontinuance notices prior to procurement. Ensure compatibility with existing thermal interface materials and mounting hardware. Validate datasheet revisions to confirm technical specifications match design requirements.
Selection Notes
Select this module for applications requiring high voltage handling and moderate current capacity. Consider the press-fit mounting style for robust mechanical connections. Evaluate thermal management needs based on the specified power dissipation and operating temperature range. Verify gate drive voltage compatibility with the +15 V rating. Assess space constraints against the module package dimensions.
Part Context
This component belongs to Infineon's CoolSiC MOSFET portfolio, specifically the EasyDUAL family. It is part of a broader range of discrete semiconductor modules designed for power electronics. The product line emphasizes efficiency and reliability in industrial and renewable energy applications.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Infineon cross-reference guides for potential alternatives. Verify pinout and electrical parameter compatibility before considering any replacement components.
FAQ
What is the maximum operating temperature for this module?
The maximum operating temperature is +150 C.
Is this module suitable for press-fit installation?
Yes, the module is designed for press-fit installation.
What is the continuous drain current rating?
The continuous drain current is rated at 150 A.
