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FFAF60A150DSTU is listed in the Diode Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is DIODE ARRAY 600V TO3PF. Review the specifications below when checking this part for your BOM.
Diode Arrays specifications for FFAF60A150DSTU
- Description：DIODE ARRAY 600V TO3PF
- Series：-
- Mfr：onsemi
- Package：Tube
- Diode Configuration：-
- Technology：-
- Voltage - DC Reverse (Vr) (Max)：-
- Current - Average Rectified (Io) (per Diode)：-
- Voltage - Forward (Vf) (Max) @ If：-
- Speed：-
- Reverse Recovery Time (trr)：-
- Current - Reverse Leakage @ Vr：-
- Operating Temperature - Junction：-
- Mounting Type：Through Hole
- Package / Case：TO-3P-3 Full Pack
- Supplier Device Package：TO-3PF
- Grade：-
- Qualification：-
Diode Arrays datasheet and documents for FFAF60A150DSTU
Diode Arrays Overview
The FFAF60A150DSTU is a diode array manufactured by onsemi, housed in a TO-3P-3 Full Pack package. It features a maximum repetitive peak reverse voltage of 600V and a forward current rating of 60A. This component is designed for high-power rectification applications requiring robust thermal management and reliable performance in demanding electrical environments.
Diode Arrays Feature Summary
- Configured as a dual diode array within a single TO-3P-3 full pack housing for space-efficient integration.
- Rated for 600V repetitive peak reverse voltage to withstand high-voltage circuit conditions.
- Supports 60A forward current for substantial power handling in industrial rectifier circuits.
Diode Arrays Applications
- Industrial power supply rectification
- High-current DC power distribution systems
- Motor drive inverter bridge circuits
Diode Arrays Procurement Notes
Verify the specific suffix 'DSTU' against official onsemi documentation to confirm package variant and tape-and-reel specifications. Confirm RoHS compliance status via the manufacturer's latest material declaration. Check for end-of-life notifications or obsolescence warnings prior to finalizing procurement plans.
Diode Arrays Selection Notes
Select this component when a dual-diode configuration is required in a TO-3P-3 package with 600V blocking capability. Ensure the application demands 60A continuous current handling. Validate thermal dissipation requirements align with the package's heat transfer characteristics for the intended operating environment.
Diode Arrays Part Context
This part belongs to onsemi's diode array product line, specifically designed for through-hole mounting. The TO-3P-3 package provides a standardized footprint for high-power discrete semiconductor devices, facilitating compatibility with existing heatsink and board layouts in industrial electronics.
Diode Arrays Replacement Considerations
Consult official cross-reference lists for direct substitutes. Verify that any alternative maintains identical pinout, voltage ratings, and current capabilities to ensure circuit compatibility without redesign.
Explore related parts through Rectifiers, Diodes, Discrete Semiconductor Products, all product categories.
