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The FGA25N120ANTDTU is a single N-channel Insulated Gate Bipolar Transistor (IGBT) manufactured by onsemi. It utilizes Non-Punch-Through (NPT) Trench technology and is housed in a TO-3P-3 package for through-hole mounting. The device features a collector-emitter voltage (Vces) of 1200 V and a continuous collector current (Ic) of 50 A at 25°C. Maximum power dissipation is rated at 312 W, with a collector-emitter saturation voltage of 2.65 V at Ic = 50 A. The operating junction temperature range spans from -55°C to +150°C.
Verify the specific suffix against official datasheets, as variations may indicate different tape-and-reel packaging or testing criteria. Confirm RoHS compliance status directly with the manufacturer documentation. Ensure the supplier provides valid traceability records for industrial-grade components.
Select this component for high-voltage applications requiring robust thermal performance and low saturation voltage. The TO-3P-3 package facilitates efficient heat sinking for high-power density designs. Evaluate thermal resistance parameters to ensure adequate cooling solutions are integrated into the system architecture.
This IGBT belongs to the FGA25N120ANTD series, representing onsemi's portfolio of high-voltage power semiconductors. The family is characterized by trench gate technology aimed at reducing switching losses while maintaining high blocking voltage capabilities suitable for demanding industrial environments.
Cross-reference with other 1200V, 50A NPT IGBTs in TO-3P packages. Verify pinout compatibility and thermal characteristics before substitution. Consult official replacement guides for equivalent performance metrics.
The maximum collector-emitter voltage (Vces) is 1200 V.
Yes, the device is designed for easy parallel operation due to its positive temperature coefficient characteristics.
The minimum operating junction temperature is -55°C and the maximum is +150°C.