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The FMG2G400LS60 is a molded IGBT power module manufactured by onsemi, designed for applications such as AC/DC welders. It features a half-bridge configuration with an integrated anti-parallel fast and soft FWD. The device supports a collector-emitter voltage of 600 V and a continuous collector current of 400 A at 25°C. Key electrical parameters include a saturation voltage of 1.4 V at 400 A, a short circuit withstand time of 10 µs at TC=100°C, and a maximum junction temperature range of -40 to +150°C. Thermal resistance from junction to case is 0.11 °C/W for the IGBT part.
Verify component authenticity through authorized channels due to potential counterfeit risks in the market. Confirm RoHS compliance status prior to integration, as datasheet documentation may vary by production batch. Ensure proper handling procedures are followed during installation to maintain thermal interface integrity and prevent mechanical damage to the module terminals.
Evaluate thermal management requirements based on the specified junction-to-case thermal resistance values. Verify that the gate drive circuit can supply sufficient current to charge the total gate capacitance within the required switching times. Ensure the operating environment stays within the specified temperature limits to maintain the rated short circuit withstand capability and long-term reliability.
This component belongs to the FMG2 series of IGBT modules from Fairchild Semiconductor, now part of onsemi. The series utilizes advanced trench technology to achieve low conduction losses and high short-circuit ruggedness. The 7PM-IA package provides a robust mechanical structure suitable for high-power industrial applications requiring reliable performance under demanding electrical conditions.
No verified public substitute part numbers are available in the provided documentation.