FNA23512A

FNA23512A

  • Description:MODULE SPM 1.2V 35A 34PWRDIP
  • Series:Motion SPM® 2

SKU:a8ddd5a06534 Category: Brand:

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Product Detailed Parameters

  • Description:MODULE SPM 1.2V 35A 34PWRDIP
  • Series:Motion SPM® 2
  • Mfr:onsemi
  • Package:Tube
  • Type:IGBT
  • Configuration:3 Phase
  • Current:35 A
  • Voltage:1.2 kV
  • Voltage - Isolation:2500Vrms
  • Mounting Type:Through Hole
  • Package / Case:34-PowerDIP Module (1.480", 37.60mm)
  • Grade:-
  • Qualification:-

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FNA23512A

Overview

The FNA23512A is a three-phase Intelligent Power Module (IPM) from onsemi's Motion SPM® 2 series. It integrates IGBT power switches with gate drivers in a single package, rated for 1.2 kV collector-emitter voltage and 35 A continuous collector current. The module features 2500 Vrms isolation between power and control circuits. It utilizes a 34-pin PowerDIP package designed for through-hole mounting, measuring 1.480 inches (37.60 mm). This component is classified as Not Recommended for New Designs.

Feature Summary

  • Integrates three-phase IGBT power stage with dedicated gate drive circuitry for simplified motor control design.
  • Provides high-voltage isolation of 2500 Vrms between the power section and low-voltage control inputs.
  • Includes built-in protection mechanisms such as over-current, short-circuit, and under-voltage lockout.

Applications

  • Three-phase AC motor drives
  • Industrial servo systems
  • Variable frequency drives

Procurement Notes

Verify the current lifecycle status before integration, as this part is designated Not Recommended for New Designs. Confirm that existing inventory or last-time buy quantities meet project requirements. Ensure compatibility with legacy designs where this specific 34-pin PowerDIP form factor is already established. Check for any pending Product Change Notifications regarding assembly sites or material declarations.

Selection Notes

Select this module when a pre-integrated three-phase solution is required for 1.2 kV applications. The 35 A rating suits moderate power motor control tasks. Consider the 34-pin PowerDIP footprint for PCB layout constraints. Evaluate thermal management needs based on the specific switching frequencies and ambient conditions of the target application.

Part Context

This component belongs to the Motion SPM® 2 series, which combines power semiconductors and driver ICs into a compact module. It serves as an evolution of earlier smart power modules, offering improved integration for motion control applications. The series is characterized by its robust packaging and integrated protection features for industrial environments.

Replacement Considerations

Consult the official datasheet for direct pin-compatible alternatives within the same series. Verify electrical parameters and thermal characteristics against potential substitutes. Note that newer series may require different driver interfaces or cooling solutions.

FNA23512AFNA23512A

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