FOD817B3SD

FOD817B3SD

$0.44
  • Description:OPTOISOLATOR 5KV 1CH TRANS 4-SMD
  • Series:-
  • Mfr:onsemi
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:c6ce344fc249 Category: Brand:

  
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Product Detailed Parameters

  • Description:OPTOISOLATOR 5KV 1CH TRANS 4-SMD
  • Series:-
  • Mfr:onsemi
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Number of Channels:1
  • Voltage - Isolation:5000Vrms
  • Current Transfer Ratio (Min):130% @ 5mA
  • Current Transfer Ratio (Max):260% @ 5mA
  • Turn On / Turn Off Time (Typ):-
  • Rise / Fall Time (Typ):4µs, 3µs
  • Input Type:DC
  • Output Type:Transistor
  • Voltage - Output (Max):70V
  • Current - Output / Channel:50mA
  • Voltage - Forward (Vf) (Typ):1.2V
  • Current - DC Forward (If) (Max):50 mA
  • Vce Saturation (Max):200mV
  • Operating Temperature:-55°C ~ 110°C
  • Mounting Type:Surface Mount
  • Package / Case:4-SMD, Gull Wing
  • Supplier Device Package:4-SMD
  • Grade:-
  • Qualification:-

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FOD817B3SD

Overview

The FOD817B3SD is a single-channel transistor output optocoupler manufactured by onsemi. It features an NPN phototransistor output with a maximum collector-emitter voltage of 70 V and a continuous collector current of 50 mA. The device provides 5000 Vrms isolation voltage and operates within a temperature range of -55°C to +110°C. Key electrical parameters include a forward current of 50 mA, a forward voltage of 1.2 V typical, and a collector-emitter saturation voltage of 200 mV maximum. The current transfer ratio ranges from 130% to 260%. Switching characteristics include a typical rise time of 4 µs and fall time of 3 µs. It is housed in a 4-SMD (鸥翼) surface-mount package.

Feature Summary

  • Provides high-voltage isolation between input and output circuits using optical transmission.
  • Features a fast switching response suitable for general-purpose signal isolation applications.

Applications

  • General-purpose signal isolation in industrial control systems
  • Interface circuits for microcontrollers and logic devices
  • Power supply feedback loops requiring galvanic isolation

Procurement Notes

Verify the specific suffix '3SD' corresponds to the 4-SMD鸥翼 package and reel/tray packaging configuration as defined by onsemi. Confirm RoHS compliance status and moisture sensitivity level (MSL 1) requirements for your assembly process. Ensure the ordering part number matches the exact current transfer ratio bin required for your design specifications.

Selection Notes

Select this component when a surface-mount solution is preferred over through-hole DIP variants like the standard FOD817B. Consider the faster switching times compared to older generations if timing constraints are critical. Verify that the 50 mA collector current rating meets the load requirements of the downstream circuitry without exceeding thermal limits.

Part Context

This part belongs to the FOD817 series, which includes various pinout and package configurations such as PDIP-4 and MDIP. The FOD817B3SD specifically denotes the surface-mount variant with optimized switching performance. It serves as a modern replacement for legacy through-hole optocouplers in compact PCB designs while maintaining similar electrical isolation standards.

Replacement Considerations

Direct physical replacements include other FOD817 series SMD variants such as FOD817A3SD or FOD817D3SD, provided the current transfer ratio specifications align with system requirements. Cross-brand equivalents should be evaluated based on pin compatibility and isolation voltage ratings.

FOD817B3SDFOD817B3SD
$0.44
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