FODM214AR2

Overview

The FODM214AR2 is a single-channel transistor output optocoupler manufactured by onsemi, designed for AC/DC sensing applications. It features an NPN phototransistor output housed in a compact SOP-4 surface-mount package. Key electrical specifications include a maximum collector-emitter voltage of 80 V and a continuous collector current of 50 mA. The device offers a high insulation voltage of 3750 Vrms to ensure signal isolation. Current transfer ratios range from 50% to 250%, with typical rise and fall times of 3 µs. It operates within a temperature range of -55°C to +110°C and dissipates up to 150 mW.

Feature Summary

• Provides galvanic isolation between input and output circuits via optical transmission.
• Features an NPN phototransistor output suitable for digital switching applications.
• Designed for AC/DC sensing inputs with high common-mode transient immunity.

Applications

• AC/DC power supply feedback loops
• Digital signal isolation in industrial control systems
• Microcontroller interface circuits requiring electrical isolation

Procurement Notes

Verify the specific suffix AR2 confirms the reel packaging format when ordering. Ensure the SOP-4 package variant matches the PCB footprint requirements. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Cross-reference the datasheet revision date to ensure alignment with latest electrical characteristics and mechanical drawings.

Selection Notes

Select this component when a single-channel isolation solution with NPN output is required. The SOP-4 package is ideal for space-constrained surface-mount designs. Consider the 3750 Vrms insulation rating for safety-critical applications. Evaluate the 50 mA collector current limit against load requirements. Verify operating temperature range compatibility with the target environment.

Part Context

This part belongs to the FODM214 series of transistor output optocouplers. The series is characterized by small form-factor packages and reliable performance for general-purpose isolation tasks. The AR2 suffix typically denotes tape-and-reel packaging for automated assembly processes.

Replacement Considerations

The FODM214A is a related variant in the same family, differing primarily in package type (MFP-4 vs SOP-4). Verify pinout compatibility and thermal characteristics before substitution. Consult official cross-reference lists for confirmed equivalent parts.