FP7G50US60

FP7G50US60

$22.70
  • Description:IGBT
  • Series:Power-SPM™

SKU:54629f65deef Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT
  • Series:Power-SPM™
  • Mfr:Fairchild Semiconductor
  • Package:Tube
  • IGBT Type:-
  • Configuration:Half Bridge
  • Vce(on) (Max) @ Vge, Ic:2.8V @ 15V, 50A
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-40°C ~ 125°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:EPM7
  • Supplier Device Package:EPM7
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):50 A
  • Power - Max:250 W
  • Current - Collector Cutoff (Max):250 µA
  • Input Capacitance (Cies) @ Vce:2.92 nF @ 30 V

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FP7G50US60

Overview

The FP7G50US60 is a dual IGBT module manufactured by Fairchild Semiconductor, designed for high-power switching applications. It features a collector-emitter saturation voltage of 2.8V at 15V gate drive and 50A current. The device operates with a maximum voltage rating of 600V and supports a continuous current of 50A. Packaged in the EPM7 chassis mount format, it dissipates up to 250W of power. This component utilizes transfer molding technology for robust insulation and thermal management.

Feature Summary

  • Dual IGBT configuration within a single compact module
  • Transfer molded construction for enhanced durability
  • Chassis mount design for efficient heat dissipation

Applications

  • Industrial motor drives
  • Inverter systems
  • Power supply units

Procurement Notes

Verify component authenticity through official Fairchild or authorized distributor channels due to obsolete status. Confirm datasheet revisions and specific lot codes against technical requirements. Ensure proper handling procedures are followed given the module's sensitivity to electrostatic discharge and mechanical stress during installation.

Selection Notes

Select this module for applications requiring reliable 600V switching with moderate current capacity. Evaluate thermal resistance characteristics against system cooling capabilities. Consider the EPM7 package dimensions for compatibility with existing heatsink infrastructure and mounting hardware constraints.

Part Context

This component belongs to Fairchild's IGBT module family, specifically the FP7 series utilizing transfer mold technology. It represents a discrete semiconductor solution for medium-power electronics, distinct from integrated circuits or smaller surface-mount devices. The module serves as a critical switching element in power conversion architectures.

Replacement Considerations

Public confirmed substitute part numbers: None identified.

FP7G50US60FP7G50US60
$22.70
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