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FQB3P20TM is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET P-CH 200V 2.8A D2PAK. Review the specifications below when checking this part for your BOM.
The FQB3P20TM is a P-Channel enhancement mode power MOSFET manufactured using planar stripe DMOS technology. It features a -200V drain-source voltage rating and a continuous drain current of -2.8A at 25°C case temperature. The device exhibits a maximum on-resistance of 2.7Ω at VGS = -10V. Key electrical parameters include a typical gate charge of 6.0nC, a reverse transfer capacitance of 7.5pF, and a single pulsed avalanche energy capability of 150mJ. It operates within a junction temperature range of -55°C to +150°C.
Verify the specific suffix 'TM' against official manufacturer documentation to confirm exact packaging or tape-and-reel specifications. Ensure the component source aligns with Fairchild Semiconductor or authorized successor entities like onsemi. Confirm RoHS compliance status and manufacturing origin prior to procurement to meet project requirements.
Select this component for designs requiring a -200V P-Channel MOSFET with moderate current handling capabilities. Consider the thermal resistance characteristics when designing heat dissipation solutions. Evaluate the gate charge requirements against available driver circuitry to ensure optimal switching speeds and minimize drive losses.
This part belongs to the QFET family produced by Fairchild Semiconductor International. The FQB3P20 variant utilizes the D2-PAK package, while the FQI3P20 counterpart uses the I2-PAK configuration. Both share identical electrical specifications but differ in physical mounting styles.
The FQI3P20 serves as a direct functional equivalent utilizing an alternative package style. Verify pinout compatibility and thermal interface dimensions before substituting between the D2-PAK and I2-PAK variants.
The device is rated for a single pulsed avalanche energy of 150 mJ.
The on-resistance increases as the junction temperature rises, following a positive temperature coefficient characteristic typical of DMOS technology.
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