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The FS150R12PT4BOSA1 is a silicon IGBT module from Infineon Technologies, belonging to the TRENCHSTOP EconoPACK PressFIT series. It features a six-pack configuration with built-in diodes and an NTC thermistor. The device supports a collector-emitter maximum voltage of 1200 V and a continuous collector current of 200 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.75 V, a gate-emitter leakage current of 100 nA, and a power dissipation rating of 680 W. The module operates within a temperature range of -40°C to +150°C and utilizes a flange mount package.
Verify the specific ordering suffix BOSA1 against official Infineon documentation to confirm exact manufacturing lot details and compliance status. Ensure that the required PressFIT tooling is available for installation, as standard screw mounting methods are incompatible with this package type. Cross-reference the component marking with the datasheet to prevent substitution errors with similar EconoPACK variants.
Select this module when high mechanical robustness is required due to its PressFIT termination, which reduces failure risks associated with thermal cycling compared to soldered connections. The 200 A current rating provides headroom for peak load conditions in three-phase inverter designs. Confirm that the system cooling solution can handle the 680 W power dissipation limit while maintaining junction temperatures within the specified operational range.
This component is part of Infineon's TRENCHSTOP IGBT4 family, specifically utilizing the EconoPACK PressFIT form factor. It serves as a direct functional equivalent to the FS150R12PT4, with the BOSA1 suffix indicating specific production or packaging variations defined by the manufacturer. The module is engineered for industrial quality standards and long-term reliability in demanding power electronics environments.
FS150R12PT4 is a confirmed substitute part number listed in official aliases. Verify that any replacement maintains the same PressFIT interface and pinout compatibility before integration into existing PCB layouts or busbar structures.