FS15R06VE3B2BOMA1

Description：IGBT MODULE 600V 22A 65W
Series：-

SKU:c63f387f9f4a Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 600V 22A 65W
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：Three Phase Inverter
Vce(on) (Max) @ Vge, Ic：2V @ 15V, 15A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：Module
Voltage - Collector Emitter Breakdown (Max)：600 V
Current - Collector (Ic) (Max)：22 A
Power - Max：65 W
Current - Collector Cutoff (Max)：1 mA
Input Capacitance (Cies) @ Vce：830 pF @ 25 V

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FS15R06VE3B2BOMA1

Overview

The FS15R06VE3B2BOMA1 is a silicon IGBT module from Infineon Technologies, belonging to the IGBT3 series and packaged in EasyPACK. It features a six-pack configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 22 A at 25°C. The saturation voltage is 1.55 V, while power dissipation reaches 65 W. Operating temperatures range from -40°C to +150°C, with a maximum gate-emitter voltage of 20 V and leakage current of 400 nA.

Feature Summary

Six-pack topology for three-phase inverter applications
EasyPACK surface-mount packaging design
Trenchstop IGBT3 technology implementation

Applications

Three-phase inverter circuits
Industrial motor drives
Switched-mode power supplies

Procurement Notes

Verify component authenticity through authorized channels due to end-of-life status. Confirm RoHS compliance and REACH SVHC details via official datasheets. Check for obsolescence notices or discontinuation notifications before procurement planning. Ensure supply chain stability as availability may be restricted.

Selection Notes

Select this module for low-power three-phase applications requiring 600V blocking capability. Compare thermal resistance and package dimensions against system constraints. Consider the 22A current rating relative to load requirements. Evaluate compatibility with standard gate drive voltages within the 20V limit.

Part Context

This part belongs to the Infineon IGBT3 family, utilizing Trenchstop technology for optimized switching performance. The EasyPACK package provides a compact solution for surface-mount assembly. It serves as a discrete power semiconductor component for converting electrical energy in industrial and consumer electronics systems.