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Product Detailed Parameters
- Description：IGBT MOD 600V 200A 600W
- Series：EconoPACK™ 3
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 200A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：200 A
- Power - Max：600 W
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：13 nF @ 25 V
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Overview
The FS200R06KE3BOSA1 is a six-pack IGBT module from Infineon's Trenchstop IGBT3 - E3 series, housed in an EconoPACK 3 package. It features a collector-emitter voltage of 600 V and a continuous DC collector current of 200 A at 60°C case temperature. The typical collector-emitter saturation voltage is 1.45 V at 25°C. Total power dissipation reaches 600 W at 25°C case temperature. The module includes integrated fast recovery diodes with a forward current of 200 A. An internal NTC thermistor provides thermal monitoring, rated at 5 kΩ at 25°C.
Feature Summary
- Integrates trench/fieldstop IGBTs with emitter-controlled diodes for efficient switching
- Includes an embedded NTC thermistor for precise junction temperature monitoring
- Utilizes the EconoPACK 3 housing design for optimized thermal management
Applications
- Three-phase motor drive inverters
- Industrial power supplies
- Uninterruptible power systems (UPS)
Procurement Notes
Verify the specific ordering suffix BOSA1 against official documentation to confirm component specifications. Ensure that the procurement channel sources directly from authorized distributors or the manufacturer to guarantee authenticity. Confirm RoHS compliance status through the latest datasheet revision before finalizing orders.
Selection Notes
Select this module when high current capacity and low conduction losses are required for industrial applications. Evaluate the thermal resistance values to ensure adequate heatsinking for the intended duty cycle. Consider the gate charge and switching energy parameters to optimize driver circuit performance and minimize overall system losses.
Part Context
This component belongs to the EconoPACK 3 family, designed for compact power conversion. It utilizes silicon technology within the Trenchstop IGBT3 generation. The module integrates multiple switches into a single unit to reduce parasitic inductance and simplify assembly in high-power electronic circuits.
Replacement Considerations
Consult official cross-reference lists for verified substitutes. Verify pinout compatibility and electrical ratings before substituting. Ensure thermal interface material requirements match the replacement component's specifications.
