SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The FS25R12W1T4PBPSA1 is a silicon IGBT module from Infineon Technologies, belonging to the Trench/Fieldstop IGBT4 series. It features a six-pack configuration with a maximum collector-emitter voltage of 1200 V and a continuous collector current of 25 A at 25°C. The typical saturation voltage is 1.85 V, and power dissipation reaches 205 W. Operating temperatures range from -40°C to +150°C. The component utilizes EasyPACK™ 1B packaging for screw mounting.
Verify the exact part number against official Infineon documentation, as standard listings often reference FS25R12W1T4 or FS25R12W1T4BOMA1. Confirm that the suffix indicates the specific RoHS-compliant tape-and-reel or tray variant intended for your assembly process. Cross-reference datasheet revisions to ensure compatibility with existing thermal interface materials and gate drive requirements.
Select this module when a 1200 V rating and 25 A continuous current are required within an EasyPACK™ 1B footprint. Ensure the application can accommodate the specified 205 W power dissipation through adequate heatsinking. Verify that the gate drive voltage aligns with the standard IGBT4 specifications to maintain optimal saturation voltage and switching characteristics.
This component is part of the broader FS25R12 product family, which includes variants like FS25R12W1T7 and F3L25R12W1T4. While sharing similar electrical ratings, differences exist in technology generation (IGBT4 vs. IGBT7) and package configurations. The PBPSA1 suffix typically denotes specific manufacturing or compliance attributes distinct from the standard BOMA1 designation.
FS25R12W1T4BOMA1
The maximum operating junction temperature is +150°C.
Yes, the datasheet for the FS25R12W1T4 series indicates the presence of an NTC thermistor for temperature monitoring.
The typical forward voltage (VF) at 25°C is approximately 1.75 V.