FS25R12W1T7PB11BPSA1

Overview

The FS25R12W1T7P_B11 is an EasyPACK module integrating TRENCHSTOP IGBT7 and Emitter Controlled 7 diodes with PressFIT technology. It features a collector-emitter voltage of 1200 V, a continuous DC collector current of 25 A at TH=65°C, and a repetitive peak collector current of 50 A. The saturation voltage is typically 1.60 V at Tvj=25°C. Operating junction temperature ranges from -40°C to 175°C. Thermal resistance from junction to heatsink is 1.48 K/W for the IGBT and 1.74 K/W for the diode. An integrated NTC thermistor provides a nominal resistance of 5.00 kΩ at 25°C.

Feature Summary

• Utilizes TRENCHSTOP IGBT7 micro-pattern trench technology for high controllability and reduced switching losses.
• Incorporates Emitter Controlled 7 diodes to minimize reverse recovery charge and energy.
• Features PressFIT contact technology for reliable connection without soldering.
• Includes pre-applied thermal interface material and an integrated NTC thermistor for thermal monitoring.

Applications

• Auxiliary inverters
• Air conditioning systems
• Motor drives
• Servo drives
• UPS systems

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm mechanical and electrical configurations. Confirm that the component matches the required insulation class and isolation test voltage specifications for the target application. Ensure compatibility with the intended gate driver circuitry regarding peak gate-emitter voltage limits.

Selection Notes

Select this module for applications requiring moderate switching frequencies and high overload capability up to 175°C. Evaluate the thermal resistance values against the system's cooling capacity to ensure junction temperatures remain within safe operating limits. Consider the low stray inductance design when calculating voltage spikes during switching transitions.

Part Context

This component belongs to the EasyPACK family utilizing TRENCHSTOP IGBT7 technology. It represents a generation of silicon modules designed for industrial power conversion. The integration of advanced trench gate structures aims to improve efficiency compared to previous generations while maintaining robust short-circuit ruggedness.

Replacement Considerations

Consult official Infineon cross-reference documents for verified substitutes. Ensure any replacement maintains equivalent voltage ratings, current capabilities, and package dimensions. Verify that alternative components support the required PressFIT mounting method or provide compatible mechanical interfaces.

FAQ

What is the maximum short-circuit duration for this module?

The module supports a short-circuit time of up to 8 µs at Tvj = 150°C and up to 7 µs at Tvj = 175°C.

Does the module include pre-applied thermal grease?

Yes, the module comes with pre-applied thermal interface material (TIM) to facilitate installation and ensure consistent thermal performance.

What is the isolation test voltage requirement?

The module requires an isolation test voltage of 2.5 kV AC for 1 minute at 50 Hz between terminals and heatsink.