FS28MR12W1M1HB11HPSA1

Power Driver Modules Overview

The FS28MR12W1M1HB11HPSA1 is a CoolSiC™ Trench MOSFET half-bridge module in the EasyPACK™ package. It features a 1200 V drain-source voltage and supports a continuous DC drain current of 30 A at 175 °C, with a repetitive peak current of 60 A. The module incorporates PressFIT contact technology and an integrated NTC temperature sensor for thermal monitoring. Electrical characteristics include a typical on-resistance of 26.4 mΩ at 25 °C and low switching losses optimized for high-frequency operation.

Power Driver Modules Feature Summary

• Utilizes CoolSiC™ Trench MOSFET technology for low switching losses and high-frequency performance
• Features rugged mounting via integrated clamps and PressFIT contact technology
• Includes an integrated NTC thermistor for precise junction temperature monitoring
• Designed with low stray inductance to minimize electromagnetic interference

Power Driver Modules Applications

• High-frequency switching applications
• DC/DC converters
• Motor drives
• UPS systems

Power Driver Modules Procurement Notes

Verify the component against the official Infineon datasheet IFX-ABB635-002 (Revision 0.20). Confirm that the part number matches the specific ordering code FS28MR12W1M1HB11HPSA1. Ensure compatibility with industrial qualification standards IEC 60747, 60749, and 60068 before integration into final designs.

Power Driver Modules Selection Notes

Select this module for designs requiring high efficiency and compact form factors in power conversion systems. The 1200 V rating and 30 A continuous current capability suit medium-power industrial applications. Consider the integrated NTC sensor for simplified thermal management and protection circuitry design.

Power Driver Modules Part Context

This component belongs to the Infineon CoolSiC™ family, specifically utilizing Trench MOSFET technology within the EasyPACK™ housing. It represents a discrete semiconductor module designed for robust industrial environments, offering improved thermal performance and electrical reliability compared to standard silicon alternatives.

Power Driver Modules Replacement Considerations

Consult the official datasheet for direct cross-references. Verify pinout compatibility and thermal resistance values when substituting similar half-bridge modules from other manufacturers or different series within the same product line.

Power Driver Modules FAQ

What is the maximum operating junction temperature?

The module supports an operating junction temperature range up to 175 °C.

How is the module connected to the PCB?

It utilizes PressFIT contact technology for secure mechanical and electrical connection without soldering.

Is there internal thermal monitoring?

Yes, an integrated NTC thermistor is included for accurate temperature sensing.