FS28MR12W1M1HB70BPSA1

$88.30

Description：LOW POWER EASY
Series：-

SKU:6cf0ecc60c91 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER EASY
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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FS28MR12W1M1HB70BPSA1

Overview

The FS28MR12W1M1HB70BPSA1 is a CoolSiC MOSFET six-pack module manufactured by Infineon Technologies. It utilizes Silicon Carbide (SiC) technology and belongs to the EasyPACK 1B series. The device features a drain-source breakdown voltage of 1200 V, a continuous drain current of 25 A, and an on-resistance of 32.3 mOhms. It operates within a temperature range of -40°C to +150°C with screw mount installation.

Feature Summary

Utilizes CoolSiC MOSFET technology for high-efficiency power switching
Integrated six-pack configuration for three-phase inverter applications
Designed for high-temperature operation up to 150°C junction temperature

Applications

Three-phase motor drives
Industrial inverters
Uninterruptible power supplies (UPS)

Procurement Notes

Verify the specific datasheet for the FS28MR12W1M1HB70BPSA1 to confirm pinout compatibility and thermal characteristics against existing designs. Ensure that the ordering suffix matches the required packaging and tape-and-reel specifications if applicable. Cross-reference the manufacturer's official documentation for any recent updates to the RoHS compliance status or recommended gate driver parameters before finalizing procurement.

Selection Notes

Select this component when a six-pack SiC configuration is required for three-phase applications. Compare the 32.3 mOhm on-resistance and 25 A current rating against system load requirements. Consider the EasyPACK 1B form factor for mechanical integration. Evaluate thermal management needs given the 150°C maximum operating temperature capability compared to silicon alternatives.

Part Context

This part belongs to Infineon's CoolSiC MOSFET family, specifically the M1H generation within the EasyPACK 1B series. It serves as a discrete semiconductor module designed to replace traditional silicon IGBTs in high-frequency, high-efficiency power conversion systems. The six-pack topology integrates multiple switches into a single package for compact design.

Replacement Considerations

Consult official substitution guides for equivalent six-pack SiC modules from Infineon or other manufacturers. Verify that alternative parts match the 1200 V rating, 25 A current capacity, and EasyPACK 1B footprint. Ensure thermal resistance and gate drive requirements are compatible with the existing circuit design.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.