FS33MR12W1M1HPB11BPSA1

$77.27

Description：LOW POWER EASY
Series：-

SKU:d96335efad4e Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER EASY
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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FS33MR12W1M1HPB11BPSA1

Overview

The FS33MR12W1M1HPB11BPSA1 is a half-bridge power module from Infineon Technologies, utilizing CoolSiC MOSFET technology. It features a 1200 V drain-source voltage rating and operates within a junction temperature range of -40°C to +175°C. The component belongs to the M1H series and utilizes the EasyDUAL package format for baseplate mounting. This discrete semiconductor module integrates two N-channel devices designed for high-efficiency switching applications.

Feature Summary

Integrates CoolSiC MOSFET technology for enhanced thermal performance
Configured as a half-bridge topology with dual N-channel devices
Designed for robust operation at elevated junction temperatures up to 175°C

Applications

General purpose motor drives
Industrial drive systems
High-frequency inverter circuits

Procurement Notes

Verify the exact part number suffix against official Infineon documentation, as variations such as BPSA1 or HPB11 may indicate specific manufacturing revisions or packaging differences. Confirm RoHS compliance status and datasheet revision levels prior to procurement to ensure compatibility with design requirements.

Selection Notes

Select this module for applications requiring high switching frequencies and reduced system size due to superior thermal conductivity. Ensure gate driver capabilities match the CoolSiC switching characteristics. Verify that the cooling solution supports the specified maximum junction temperature limits under expected load conditions.

Part Context

This component is part of Infineon's CoolSiC portfolio, specifically the M1H series within the EasyDUAL family. It serves as a silicon carbide alternative to traditional IGBT modules, offering lower switching losses. Similar variants include FF33MR12W1M1HB11BPSA1 and evaluation boards like EVAL-FS33MR12W1M1HM5.

Replacement Considerations

Cross-reference with FF33MR12W1M1HB11BPSA1 for potential functional equivalence within the same product family. Verify pinout compatibility and thermal interface specifications before substituting any other half-bridge SiC modules.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.