FS3L200R10W3S7FB11BPSA1

FS3L200R10W3S7FB11BPSA1

$130.29
  • Description:IGBT MODULE LOW POWER EASY
  • Series:EasyPACK™

SKU:d98d9e5dd12c Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT MODULE LOW POWER EASY
  • Series:EasyPACK™
  • Mfr:Infineon Technologies
  • Package:Bulk,Tray
  • IGBT Type:Trench Field Stop
  • Configuration:Three Level Inverter
  • Vce(on) (Max) @ Vge, Ic:1.55V @ 15V, 25A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:AG-EASY3B
  • Voltage - Collector Emitter Breakdown (Max):950 V
  • Current - Collector (Ic) (Max):70 A
  • Power - Max:-
  • Current - Collector Cutoff (Max):31 µA
  • Input Capacitance (Cies) @ Vce:6.48 nF @ 25 V

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FS3L200R10W3S7FB11BPSA1

Overview

The FS3L200R10W3S7F_B11 is an EasyPACK™ module integrating TRENCHSTOP™ IGBT7 and CoolSiC™ Schottky diodes with PressFIT technology. It features a collector-emitter voltage (VCES) of 950 V, implemented collector current (ICN) of 100 A, and repetitive peak collector current (ICRM) of 200 A. The boost diode has a repetitive peak reverse voltage (VRRM) of 1200 V and implemented forward current (IFN) of 30 A. The module includes an integrated NTC thermistor with a rated resistance (R25) of 5 kΩ.

Feature Summary

  • Utilizes TRENCHSTOP™ IGBT7 technology for low switching losses
  • Integrates CoolSiC™ Gen 5 Schottky diodes for high efficiency
  • Employs PressFIT contact technology for robust connection
  • Includes an integrated NTC temperature sensor

Applications

  • 3-level applications
  • Solar applications
  • UPS systems

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm exact configuration details. Ensure compatibility with the required PCB hole pattern and mounting torque specifications before procurement. Cross-reference datasheet version 3.0 for accurate electrical parameters.

Selection Notes

Select this module for designs requiring high power density and low thermal resistance. Verify that the system operates within the specified junction temperature range of -40°C to 150°C. Confirm that the gate drive circuitry supports the recommended ±15 V operation and internal gate resistor values.

Part Context

This component belongs to the EasyPACK™ family featuring TRENCHSTOP™ IGBT7 and CoolSiC™ technologies. It is designed for compact industrial power conversion systems. The module combines advanced semiconductor materials with mechanical PressFIT connections to enhance reliability and simplify assembly processes in high-power environments.

Replacement Considerations

Consult official Infineon substitution guides for verified alternatives. Ensure any replacement matches the EasyPACK™ form factor, Pin grid arrangement, and electrical ratings including VCES and ICN.

FAQ

What is the maximum repetitive peak reverse voltage for the boost diode?

The boost diode has a maximum repetitive peak reverse voltage (VRRM) of 1200 V.

What is the rated resistance of the integrated NTC thermistor?

The NTC thermistor has a rated resistance (R25) of 5.00 kΩ at 25°C.

What is the isolation test voltage of the module?

The module has an isolation test voltage (VISOL) of 3.2 kV RMS at 50 Hz for 1 minute.

FS3L200R10W3S7FB11BPSA1FS3L200R10W3S7FB11BPSA1
$130.29
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