FS400R07A1E3BOMA1

Overview

The FS400R07A1E3BOMA1 is a HybridPACK 1 IGBT module from Infineon Technologies, part of the Trenchstop IGBT3 - E3 series. It integrates an IGBT and diode in a six-in-one configuration designed for high power density. The module utilizes silicon technology with a collector-emitter voltage rating of 650 V and a continuous collector current of 400 A at 25°C. It features a maximum junction temperature of 150°C and operates within a temperature range of -40°C to +150°C. The component includes an integrated NTC temperature sensor and is housed in a HybridPack1 package.

Feature Summary

• Integrates IGBT and diode in a compact six-in-one configuration
• Incorporates third-generation trench gate field-stop IGBT3 technology
• Includes integrated NTC temperature detection sensor
• Designed for high power density applications

Applications

• Small pure electric vehicles
• Hybrid electric vehicles

Procurement Notes

Verify authenticity through authorized channels as this component is marked as End-of-Life (EOL) by the manufacturer. Confirm the specific suffix BOMA1 matches project requirements, as it may indicate specific packaging or testing variations. Check for RoHS compliance status and lead times due to potential obsolescence.

Selection Notes

Select this module for applications requiring 650V/400A ratings in space-constrained environments. Ensure thermal management solutions support the 150°C maximum junction temperature. Verify that the HybridPack1 footprint fits the PCB layout and that the driver circuitry supports the switching characteristics of the IGBT3 generation.

Part Context

This part belongs to the HybridPACK 1 family, specifically engineered for automotive traction inverters. It represents the transition to higher power densities using IGBT3 technology. The BOMA1 suffix typically denotes specific tray packaging or quality assurance configurations within the standard product line.

Replacement Considerations

As the component is End-of-Life, direct replacements are limited. Consider the FS400R07A3E3 for updated IGBT3 variants or the FF400R07KE4 for different packaging options. Evaluate design changes required for pin compatibility and thermal performance when switching families.