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Product Detailed Parameters
- Description：IGBT MOD 1200V 400A 1500W
- Series：HybridPACK™ 2
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Full Bridge
- Vce(on) (Max) @ Vge, Ic：1.85V @ 15V, 300A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：400 A
- Power - Max：1500 W
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：25 nF @ 25 V
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Overview
The FS400R12A2T4IBPSA1 is a silicon IGBT module from Infineon Technologies, utilizing the HybridPACK2 package. It features a Trench/Fieldstop IGBT4 technology with an integrated NTC thermistor for thermal monitoring. The device has a collector-emitter voltage rating of 1200 V and a continuous collector current of 400 A at 25°C. Key electrical parameters include a typical saturation voltage of 1.98 V at 400 A and 25°C, and a maximum power dissipation of 1500 W. The operating junction temperature range extends from -40°C to +150°C.
Feature Summary
- Integrated NTC thermistor for precise junction temperature monitoring
- HybridPACK2 packaging for optimized thermal performance and mechanical stability
- Trench/Fieldstop IGBT4 technology for low conduction losses
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific suffix IBPSA1 against official Infineon documentation to confirm the presence of the NTC thermistor and exact pinout configuration. Ensure compatibility with existing cooling solutions given the 1500 W power dissipation rating. Check for RoHS compliance status in the latest datasheet revision before finalizing procurement specifications.
Selection Notes
Select this module for applications requiring high current density and reliable thermal management within a compact form factor. The 1200 V rating suits medium-voltage industrial systems. Consider the 150°C maximum junction temperature limit when designing heatsinking strategies to ensure long-term reliability under varying load conditions.
Part Context
This component belongs to Infineon's HybridPACK2 series, designed for robust industrial power applications. It represents a generation of modules integrating advanced IGBT chips with efficient packaging to reduce parasitic inductances and improve switching performance compared to older discrete or standard module formats.
Replacement Considerations
Direct replacements may include other Infineon HybridPACK2 modules with similar voltage and current ratings, such as the FS400R12A2T4 without the NTC if thermal sensing is not required. Verify pin-to-pin compatibility and thermal resistance values before substituting.
