FS450R07A2P2B31BOSA1

Description：IGBT MODULE PACK DRV HYBRIDD-1
Series：-

SKU:2627e7f03a1e Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE PACK DRV HYBRIDD-1
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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FS450R07A2P2B31BOSA1

Overview

The FS450R07A2P2B31BOSA1 is a six-pack IGBT module from Infineon Technologies, utilizing Trenchstop technology. It features a collector-emitter voltage of 650 V and a continuous collector current of 800 A at 25°C. The saturation voltage is 1.4 V, with a maximum power dissipation of 1.55 kW. Operating temperature ranges from -40°C to +150°C. The device uses a HybridPack 2 package with screw mounting.

Feature Summary

Six-pack configuration for three-phase inverter applications
Trenchstop IGBT technology for optimized switching performance
HybridPack 2 packaging for compact integration

Applications

Industrial motor drives
Uninterruptible power supplies (UPS)
Induction heating systems

Procurement Notes

Verify the specific suffix B31 against official datasheets to confirm pinout and thermal characteristics. Confirm availability status as distribution data may vary. Ensure compatibility with existing gate driver requirements and thermal management solutions before procurement.

Selection Notes

Select this component for high-current applications requiring 650 V blocking capability. Consider the 800 A rating and 1.55 kW power dissipation limits. Evaluate thermal resistance requirements for the HybridPack 2 package. Verify that the operating temperature range meets system constraints.

Part Context

This module belongs to Infineon's Trenchstop IGBT series, designed for robust power conversion. The HybridPack 2 form factor offers high power density. It is part of the broader portfolio of silicon-based IGBT modules used in demanding industrial environments.